BGA Machine For Laptop

                         BGA machine for laptop mobile phone and hashboard

Designed in 2021,upgraded from DH-G620, more automatic for BGA,POP,QFN and

other chips desoldering, mounting and soldering, beautiful look and pratical function,

such as, HD monitor, splited camera for dots of chip&PCB and laser point for simple

locating, which are very satified with reworking on macbook, desktop, car PCBA, hash

board and game console machine repairing,etc.

 

Ⅰ. Parameter of BGA rework machine for bga rework automatic machine

Power supply	110~240V 50/60Hz
Rated power	5500W bga rework station machine
Heating mode	Independent for 3-heating-zone
Chip pick-up	Vacuum activated by pressure
Chip dots imaging	imaged on monitor by camera taking
Laser point	pointed at center of chip bga laser rework machine
USB port	System upgraded, temperature profile downloaded
Zoom in/out	Max 200x with automatic focous
PCB size	370*410mm best bga rework machine
Chip size	1*1~80*80mm
PCB position	V-groove, Moveable platform at X, Y with universal fixtures
Monitor screen	15 inches
Touchscreen	7 inches bga rework system
Thermocouple	1 pcs (optional)
LED bulb	10W with flexible stem
Upper air-flow	adjustable
Cooling system	automatic
Dimension	700*600*880mm
Gross weight	65kg bga bga repair machine for laptop motherboard

Ⅱ. A part of chips which often are reworked as below: 

nglish

 

In fact, we can not rework these chips as above, but also the flip chip components,which are

rarely used in PCB assembly, but they are becoming increasingly important as the need for

miniaturization of electronic components grows. Flip chips are bare chips that are mounted

directly on the circuit carrier without any further connecting wires, with the active side facing

down. This means they are exceptionally small in size. This technique is often the only suitable

assembly possibility for very complex circuits with thousands of contacts. Typically, flip chips

are assembled via conductive bonding or pressure bonding (thermocompression bonding),

other options include soldering, which is the way we do.

 

Ⅲ. Fundamental of desoldeirng and soldering of bga rework equipment

There are 2 hot-air for soldering or desoldering, and 1 large IR preheating area for PCB being preheated,

which can make PCB protected during heating or heating finished. bga station

 

Ⅳ. Machine's structure and function of bga rework station machine price

Upper head	Auto up and down with upper hot-air heater of bga machine
Monitor screen	chip and motherboard imaging on reballing machine
Optical CCD	split-vision for chip and motherboard
IR preheating	PCB preheating bga machine price
Cooling fan	Auto start after maschine stop working
Left IR switch	IR switch of bga reballing machine
Zoom in/out	press down
Laser point	press down
Light switch	press down
Angel rotating	Rotating
Light	Lighting
Lower/upper nozzle	soldering or desoldering
Micrometers	PCB moved +/- 15mm at X or Y axis
Right IR switch	IR switch
Upper HR adjusting	Hot-air-flow adjusting bga rework machine
CCD light adjusting	Light source adjusting
Emergency knob	Press down
Start	Press down
Thermocouple port	External temperature testing, 1 pcs mobile ic reballing machine
Human-machine operation interface	Touchscreen for time and temperature setting

 

Ⅴ. Demo video of best bga rework machine

 

Ⅵ. After-sales service of ic reballing machine

Warranty: 12 months or more (depends on customer's requirement)

Service way: online support or video-call, dispatching engineers to on-site/filed is available as well.

Service cost: free parts in warraty period, free service but a little price-cost after warranty. for auto-

matic bga reballing machine.

 

 

Ⅶ.Shipping term of chip reballing machine

Min order: 1 set, we suggest using express way for less quantity.

If massive quantity, sea or rail wai shipping is availble. for chip reballing machine

EXW, FOB or DAP and DDP etc. are OK.

 

 

Ⅷ. Relevant knowledge of BGA rework machine bga placement machine

Rework is defined as an operation which returns a printed wiring assembly (PWA)/part to its original

configuration. Rework should not be considered as repair. Some of the important requirements of

rework are as follows:

§ There is no electrical or mechanical damage imparted to the PWA.

§ Proper equipment is available to accomplish the rework.

§ Rework should be performed only after proper documentation of discrepancies.

§ The rework procedures, whether in-house or at the vendor/contract manufacturer, should be approved.

§ The PWA should be cleaned prior to the rework using approved procedures. Special cleaning procedures

should be adopted if conformal coating exists on the PWA.

§ The use of a solder wicking braid is permissible during rework.

1. Coplanarity

The coplanarity of a part/PWA should meet the above requirements, metallic tweezers should not be used

to rework leaded parts, molded tools should be employed to handle the PWA during rework, Electrostatic

Discharge (ESD) safe tools should be used, cleaning after coplanarity rework, etc.

1.1Solder Paste and Part Alignment Rework (Pre-reflow)

Solder paste and parts that do not meet the alignment requirements may be reworked as follows: manually

realign with the aid of an approved hand tool, the solder paste not to be disturbed and this process should

not exhibit smearing or bridging after the part movement. If the solder becomes smeared the part and solder

paste should be carefully removed and all visible traces of solder paste should also be removed from the affe-

cted area on the PWB. If the PWB is populated with additional parts, new solder paste should be deposited on

the footprint with a solder paste syringe dispenser, and the part remounted. If the PWB is unpopulated it shou-

ld be completely cleaned of solder paste, and the cleaned PWB should be inspected for conformance of manuf-

acturing. The parts may be reused after the parts leads are cleaned using approved solvent, etc.

1.2Part Replacement and Realignment (Post-reflow)

Hot air or hot gas rework stations are permissible provided it can be demonstrated the hot air or gas does not

reflow the solder of the adjacent solder connections. Wicking of solder with wicking braid and a hand soldering

tool is permissible for most parts. The exceptions are leadless chip carriers, ceramic capacitors, and resistors. The

reworked area should be cleaned thoroughly prior to the deposition of fresh solder paste. Hand soldering of par-

ts is permissible provided all necessary precautions are observed to prevent part damage.

With the continuing evolution toward smaller components, higher board densities and more diverse mixes, proc-

ess equipment has been extended beyond the limits of its capabilities. In an industry where lead pitches and chip

sizes are beyond the limits of the naked eye, components are being mounted at ever-higher speeds. This means

rework is a fact of life and will remain so into the foreseeable future. Repairing and reworking a PWB can be acco-

mplished at any point during the assembly. Today's rework stations have the capability to remove components

with nozzles that direct heat at prescribed temperatures to the component interconnects. As a result, the solder

melts without surrounding devices being affected. The component is then lifted from the board using a vacuum

pickup incorporated in the nozzle. More sophisticated machines also incorporate vision alignment to ensure pre-

cision in mounting the replacement component. Reworking components on PWB is not restricted to leaded devi-

ces or even FR-4 substrates. Array components, such as ball grid arrays and flip-chips, can be removed and repla-

ced. Flip-chips can be reworked because testing of the components usually occurs prior to dispensing and curing

of the underfill. For components where the underfill has been applied, the process is more complicated, as the e-

poxy is more difficult to remove from the board.

Rework systems differ in design and capability. Certain features, however, are particularly important to successfully

replace defective components. As with assembly, the bottom line is cost and throughput, as well as passing inspe-

ction test. Rework should be independent of the individual operation. A flat platform for achieving coplanarity and

an X-Y alignment system that ensures precision and repeatability in positioning are paramount. Substrate mounting

should be secured in a fixture that permits the board to expand during heating, and the platform should incorporate

adjustable supports for the underside of the board to prevent sagging because of heat and component weight .