IR BGA Rework Machine
DH-G600 is a cost-effective automatic BGA rework station designed for precise PCB repair and chip rework. Equipped with optical alignment, three-zone heating, HD touch screen control, and stable temperature performance, it is suitable for soldering and desoldering BGA, QFN, and other SMT components in electronics repair and manufacturing.
Description
Products Description
DH-G600 is an Infrared BGA rework station designed for precise PCB repair and advanced SMT rework applications. As one of the best BGA rework station solutions for electronics repair, it combines optical alignment, three-zone heating, and stable temperature control to deliver accurate soldering and desoldering performance.
This automatic BGA rework machine is suitable for BGA, QFN, QFP, and other SMT components used in laptops, mobile phones, servers, and industrial motherboards. The Infrared BGA rework station design improves heating efficiency while reducing thermal damage to surrounding components.
With HD touch screen control and reliable operation, the DH-G600 automatic BGA rework machine is widely used in professional repair centers and electronics manufacturing. Its precision and efficiency make it a preferred choice for users searching for the best BGA rework station for PCB repair.
Products specification
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Item
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Parameter
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Power supply
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AC220V±10％ 50/60Hz
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Total power
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5600W
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Top heater
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1200W
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Bottom heater
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1200W
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Infrared heater
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3000W
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Dimensions
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L610*W920*H885 mm
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PCB size
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Max 390×360 mm Min 10×10mm
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BGA chip
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1*1-50*50 mm
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External temperature sensor
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1 pc (optional)
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Temperature accuracy
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±2℃
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Net weight
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65kg
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Temperature control
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K Sensor, closed loop
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Products features
Main Features of BGA Rework Station DH-G600
Product Application
| Applications of Automatic BGA Rework Station | Types of Chips an Automatic BGA Rework Station Can Repair |
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BGA chip soldering and desoldering PCB motherboard repair and rework SMT component replacement and reballing Laptop and desktop motherboard repair Mobile phone and tablet PCB repair Automotive electronics and ECU repair Server and communication board maintenance Industrial control board repair Electronics manufacturing and quality rework R&D laboratory and prototype testing applications
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BGA (Ball Grid Array) chips QFN (Quad Flat No-lead) chips QFP (Quad Flat Package) chips CSP (Chip Scale Package) chips POP (Package on Package) chips SOP / SOIC integrated circuits GPU and CPU chips Memory chips (RAM, NAND, eMMC) Power management ICs Communication and network chips |
Company information
If you have any further questions or require assistance, please do not hesitate to contact us. We would be more than happy to assist you!
