Fully Automatic Optical Alignment BGA Rework Station

 

 

The Dinghua DH-A7(Industrial BGA repair system) is a professional, high-capacity fully automatic optical alignment BGA rework station engineered for rigorous industrial manufacturing and repair environments. It combines high-performance thermal management with advanced vision systems to ensure consistent, repeatable results for high-density PCBAs.

 

Here is a professional breakdown of its technical advantages:

 

1. Advanced Optical Alignment & Precision

The industrial BGA repair system utilizes a high-definition CCD optical alignment system with split-vision technology. This allows for the simultaneous viewing of the BGA solder balls and the PCB pads, ensuring micron-level placement accuracy. The automated Z-axis movement eliminates human error during the critical pick-and-place and soldering phases.

 

2. Sophisticated Thermal Management (3-Zone Heating)

The DH-A7(BGA soldering machine with CCD camera) is a 3-zone heating BGA station designed to handle large, complex boards:

Large-Area IR Preheating: The expansive bottom infrared surface provides uniform heat across the entire board, effectively preventing PCB deformation and warping.

Precision Hot Air: Top and bottom hot air heaters feature independent closed-loop temperature control, maintaining a stability of ±1°C for delicate lead-free soldering processes.

 

3. Structural Integrity & Board Protection

Safety is paramount in the DH-A7(BGA soldering machine with CCD camera) design. The integrated PCB support system and universal fixtures protect sensitive multi-layer motherboards from thermal stress. By maintaining a flat profile throughout the reflow cycle, the machine ensures the long-term reliability of the repaired assembly.

 

4. Intelligent User Interface

Designed for a streamlined workflow, the PLC-controlled touch screen interface offers an intuitive, "one-button" operation mode. Technicians can easily store and recall hundreds of thermal profiles, making the transition between different board types fast and efficient.

 

 

 

 

 

 

 

 

 

 

Total Power	11500W
Top heater	1200W
Lower heater	1200W
Bottom heater	9000W (German heating element, heating area 860×635)
Power Supply	AC380V±10％ 50/60Hz
Dimensions	L1460×W1550×H1850 mm
Operation mode	Automated desoldering, soldering, suction, and placement in one integrated system.
Temperature profile storage	50,000 sets
Optical CCD lens	It extends and retracts automatically, and can be freely moved forward, backward, left, and right via a joystick, eliminating the problem of "blind spots" during observation.
Positioning	V-shaped card slot, PCB support bracket is adjustable in the X direction and comes with a universal clamp.
BGA position	Laser positioning allows for quick identification of the vertical points of the upper and lower temperature zones and the center of the BGA.
Temperature control	K-type thermocouple (K Sensor) , Closed-loop control
Temp accuracy	±3 degrees
Repeatable placement accuracy	+/-0.01mm
PCB size	Max 900×790 mm Min 22×22 mm
BGA chip	2×2-80×80mm
Minimum chip spacing	0.25mm
External Temperature Sensor	5
Net weight	820kg
Upper and lower temperature zones	Synchronized movement
Aging time	48 hours
Preheating zone	Infrared heating tube, heats up quickly.
Program	The program is pre-configured and easy to operate.
Application	Enterprise smd smt motherboard, pcb chip remove, soldering and desoldering ect.
Warranty	1 year