Lg G3 Motherboard BGA Reballing Table Tool

BGA Positioning = Laser Position + V Groove Bracket + Universal Fixture Feeding System = Auto Picking + Feeding 3 Heaters = 2 hot airs heating + IR Preheating system

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Description

lg g3 Motherboard BGA Reballing Table Tool DH-A2E

Working Demo:

Desoldering BGA Ball and tin

A2E Assemble

Specifications:

1	Total power	5200w
2	3 independent heaters	Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w
3	Voltage	AC220V±10% 50/60Hz
4	Electric parts	7'' touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning
5	Temperature control	K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃.
6	PCB positioning	V-groove + universal fixture + movable PCB shelf
7	Applicable PCB size	Max 370x410mm Min 22x22mm
8	Applicable BGA size	2x2mm~80x80mm
9	Dimensions	600x700x850mm (LWH)
10	Net weight	70 Kg

Applications:

Characteristic:

A2E 内部发热系统

lg g3 Motherboard BGA Reballing Table Tool DH-A2E

The DH-A2E Split-Vision BGA Rework Station features a high-resolution vision system. The system accommodates boards up to 450 millimeters and places components from 2 millimeters to 80 millimeters. If you need more capability, an upgrade for larger boards is available. This model comes with a three-zone, 2,700-watt IR preheater. Other features include a 1,200-watt component heater on the top side and a 1,200-watt component heater on the bottom side. The color optical system is equipped with split vision, zoom, micro-adjust, auto-focus, and software-operated camera functionalities. The rework station is ready to plug in and use.

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