Optical Labtop BGA Rework Station
1. Quick preview: Features of DH-G600 BGA Rework Machine
Description
Optical laptop bga rework station
1. Quick preview:
Features of DH-G600 BGA Rework Machine
1. Widely used in Chip Level Replacement in laptops, computers, Moblie Phones, etc.
2. Automatic Removing, Mounting and Soldering.
3. HD Optical Alignment system for precisely mounting BGA and Components.
4. Laser Positioning can quickly align BGA Chip and motherboard.
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Product parameter
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3. The main features of the DH-G600 BGA rework station
- Field of Application ( Whole Range of Rework Applications)
- Medium & Large Scale Service Centers.
- Mobile and radio systems devices.
- Cellular phones , PDAs , Handhelds, notebooks & Motherboards.
- LAN devices , Network Nodes and Military communication equipment.
- Portable medical equipment
Features:
1. Flexible uses for all different kinds of components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA, and All Epoxy undefiled micro BGA ..etc.
2. Complete reworking Processes(Pr-Heating, Soak, Re-Flow & Cooling) stages are achieved for an accurate and standard reworking process.
3. IR with no effect on adjacent Components.
4. Sensitive Temperature measurement sensor to obtain an accurate and instantaneous Temperature reading and monitoring.
5. Internal Picking System for Safe and Stable Removal of the ICs.
6. cooling system to achieve a complete and Standard & cooling stage process for PCBs.
7. Tool for reballing
8. Positioning during the rework process is applicable by using a laser pointer on PCB
9. Precise and smooth running X-Y table included with the package.
10. Easy & Friendly operation Via Manual modes.
11. One-year Warranty applies.
4. Detailed Images of G600 BGA REWORK STATION

HD Optical CCD Lens Alignment System
The camera is imported from Panasonic, Japan to ensure the replacement accuracy at ±0.01mm

Mounting head with built-in pressure testing device, to protect the PCB from damage.
build-in vacuum in mounting head picks up BGA chip automatically after desoldering completed

With top airflow adjust, to prevent tiny bga from blowing away.

PCB Positioning
V-groove, PCB boards can be adjusted in X, and Y axis and equipped with a universal fixture
4. Company Profile
Part of our Clients

6. Packing & Delivery & Services of G600 BGA REWORK STATION
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Delivery options |
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◆ Sample would be sent within 5 business days after receiving full payment. 7-15 days for bulk orders. ◆ Shipping By DHL, FedEx, TNT, EMS, and UPS express. Shipment by sea is also available. |
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DH-G600 Accessories |
-1 piece user guide -1 piece LCD -5 pcs hot air nozzle: top nozzle 3pc(31x31mm,38x38mm,41x41mm), Bottom nozzle 2pcs (34x34mm,55x55mm)PS: Hot air nozzle size can be customized according to your chip size -1 set of vacuum sucker(including 4 pcs) -2 pcs vacuum pad -6 pcs universal fixture -4 pcs supporting screw -6 pcs Plum knob |


7. The FAQ of the G600 BGA REWORK STATION
Q1: Why choose us?
A1:1. Dinghua has more than 10 years of experience.
2. Professional and experienced technician team.
3. With a high-quality product, favorable price, and timely delivery.
4. Reply to all your inquiries within 24 hours.
Q2: How about the delivery method?
A2: Normally we will take expresses such as DHL, FedEx, UPS, and TNT for sample orders. For bulk orders, will take air flights or Sea shipment.
Q3: What is the bulk order delivery time?
A3: Order lead time will be 5-10 working days
Q4: How long is your warranty?
A4: Lasts for 12 months.
8. Related Knowledge
There are many reasons why people rework their electronic equipment. The most common reasons are faulty components, the need to replace outdated engineering parts, poor solder joints, and unwanted solder drops. Some of this work is done during the repair of mobile phones.
When performing a rework, skilled professionals must protect surrounding parts. They do this by keeping thermal stress on the assembly as low as possible. This helps to avoid potentially dangerous contractions of the board.
The first step in rework is using a hot-air gun to heat a single surface-mount device. This melts all the solder joints between the printed circuit board and the surface-mount device. The second step is removing the surface-mount device, and the third step is cleaning the pad array on the conductor to remove the old solder. Old solder is easily removable. All you need to do is heat it to its melting point. A desoldering braid, a hot air gun, and a soldering iron are used for this purpose.
To complete the steps above, skilled professionals use a vision-alignment system. The top-of-the-line equipment has high resolution and is highly accurate. This system enables the new component to be precisely placed on the pad array.
Once everything is done, the surface-mount device is soldered onto the circuit board. The solder profile is used to preheat the circuit board. It is also used to heat the connections between the printed circuit board and the device.











