Optical Alignment Mobile IC Repairing Tools

                    Optical Alignment Mobile IC Repairing Tools 

Optical Alignment Mobile IC Repairing Tools are specialized equipment used for precision repair and alignment of integrated circuits (ICs) in mobile devices like smartphones. These tools, often part of BGA rework stations, include high-precision optical systems, such as microscopes or cameras, to accurately position ICs. They ensure the proper alignment of small components, like BGA chips, with circuit board pads. The system also includes soldering or rework equipment with automated features and precise temperature control, allowing for safe and efficient repairs.

 

Desoldering BGA Ball and tin

 

Specifications:

1	Total power	5200w
2	3 independent heaters	Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w
3	Voltage	AC220V±10% 50/60Hz
4	Electric parts	7'' touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning
5	Temperature control	K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃.
6	PCB positioning	V-groove + universal fixture + movable PCB shelf
7	Applicable PCB size	Max 370x410mm Min 22x22mm
8	Applicable BGA size	2x2mm~80x80mm
9	Dimensions	600x700x850mm (L*W*H)
10	Net weight	70 Kg

Applications:

 

Characteristic:

 

 

 

Packing List :

Materials: Strong wooden case+wooden bars+proof pearl cottons with film

1pc Optical Alignment Mobile IC Repairing Tools  

1pc brush pen

1pc Instruction Manual

1pc CD video

3pcs top nozzles

2pcs bottom nozzles

6pcs universal fixtures

6pcs fastened screws

4pcs support screw

1pc tweezer

Sucker size: Diameters in 2,4,8,10,11mm

Inner hexagon spanner: M2/3/4

Dimension:81*76*85CM

Gross weight: 115 kg

 

FAQ

1. How is the package doing? Is the distribution process secure?

a sturdy hardwood case, wooden bars, and proof pearl cotton wrapped in film all work together to keep

 the machine secure throughout shipping.

2. How will it be delivered? How long will it take the machine to arrive?

Usually takes around 5 days by Courier by DHL, FedEx, UPS, etc.

Or you can travel by plane (Door to Airport Service) and arrive in around three days.

Instead, you can travel by boat to the seaport; the minimum CBM need is 1 CBM, and the journey takes 30 days.

3.Are you able to offer the Warranty? What about the post-purchase support?

The machine has a one-year warranty, and technical assistance is free.

After you purchase one of our machines, we offer technical assistance and educational films that are attached 

to the equipment.

4. Is it simple to use this machine? Can I still use it effectively if I don't have any skill?

Indeed, our machines are made to be simple to operate. While learning to use them typically takes between two 

and three hours, if you are skilled, learning will go much more quickly.

5, Will you give us free training if we visit your factory?

absolutely! We cordially invite you to attend a training at our factory.

6. What are the terms of payment?

T/T, MoneyGram, Western Union, PayPal, etc.

 

 

Specification:

 

Total Power	5200W
Top heater	1200W
Bottom heater	2nd 1200W, 3rd IR heater 2700W
Voltage	AC220V/110V±10％ 50Hz
Feeding system	Auto feeding system for chip
Operation mode	Two modes: manual and automatic, free choose! HD touch screen, intelligent human-machine, digital system setting.
Temperature profile storage	50,000 groups(un-limited number of groups)
Optical CCD camera lens	Automatic stretching out and folding to pick and place BGA chip
Camera magnification	1.8 million pixels
Workbench fine-tuning:	±15mm forward/backward, ±15mm right/left
Placement accuracy:	±0.015mm
Bga positioning	Laser positioning, fast and accurate position of PCB and BGA
PCB position	Intelligent positioning, PCB can be adjusted in X, Y direction with "5 points support" + V-groov pcb bracket + universal fixtures.
Lighting	Taiwan led working light, any angle adjustable
Temperature control	K sensor, close loop, PLC control
Temp accuracy	±2℃
PCB size	Max 450×400 mm Min 22×22 mm
BGA chip	1x1 - 80x80 mm
Minimum chip spacing	0.015mm
External temper sensor	1pc
Dimensions	L740×W630×H710 mm
Net weight	70KG