Infrared SMT Soldering System DH-A2
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Infrared SMT Soldering System DH-A2

Infrared SMT Soldering System DH-A2

1.HD CCD optical alignment system for positioning 2.superior safety function with emergency protection 3.top heating head and mounting head 2 in 1 design 4.top air flow adjustable to meet the demand of any chips

Description

Infrared SMT Soldering System DH-A2

DH‑A2 from Shenzhen Dinghua Technology is a semi‑automatic / hybrid IR + hot‑air SMT rework station tailored to mobile phone, laptop, gaming console, and electronics motherboard repairs. It integrates:

  • Top and bottom hot-air heaters (≈ 1,200 W each)
  • Bottom infrared pre‑heating zone (≈ 2,700–3,000 W)for even heating of PCBs and components
  • Vision system with CCD camera and optional laser positioning for precise alignment.
  • Embedded industrial PC / PLC & touchscreen HMI, supporting auto/manual modes, vacuum pickup, position sensing, profile storage & analysis

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Specifications
1
Total power
5300w
2
3 independent heaters
Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w
3
Voltage
AC220V±10% 50/60Hz
4
Electric parts
7'' touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning
5
Temperature control
K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃.
6
PCB positioning
V-groove + universal fixture + movable PCB shelf
7
Applicable PCB size
Max 370x410mm Min 22x22mm
8
Applicable BGA size
2x2mm~80x80mm
9
Dimensions
600x700x850mm (L*W*H)
10
Net weight
64 Kg

DH-A2-details.jpg

 

Playstation-4-BGA-Infrared-Rework-Station-DH

Advanced Features

① Top hot air flow is adjustable to meet the requirements of various chips.
② Supports automatic desoldering, mounting, and soldering.
③ Built-in laser positioning system for fast PCB alignment.
④ Infrared heating system with three independent heaters.
⑤ Mounting head includes a built-in pressure detection device to prevent PCB damage.
⑥ Built-in vacuum in the mounting head automatically picks up the BGA chip after desoldering is complete.

A2 packing list

  1. Machine:1 set
  2. All packed in stable and strong wooden cases,suitable for import and export.
  3. Top nozzle:3 pcs (31*31mm,38*38mm,41*41mm)Bottom nozzle:2pcs(34*34mm,55*55mm)
  4. Beam:2 pcs
  5. Plum knob: 6 pcs
  6. Unicersal fixture:6 pcs
  7. Support screw:5 pcs
  8. Brush pen:1 pcs
  9. Vacuum cup:3 pcs
  10. Vacuum needle:1 pcs
  11. Tweezer:1 pcs
  12. Temp sensor wire:1 pcs
  13. Professional Instruction Book:1 pcs
  14. Teaching CD: 1 pcs

 

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