Smartphone Motherboard Repair Machine
Professional Automatic IC Chip BGA Repair Machine DH-G620– Precision Rework Solution
Description
Product Overview
This automatic ic chip bga repair machine is a state-of-the-art smd desoldering station engineered for electronic repair professionals. As a specialized iphone repair machine, it delivers unmatched precision for reworking BGA, SMD, and tiny IC chips, making it ideal for phone repair shops, electronics manufacturers, and R&D labs. Whether you're fixing iPhone motherboards or industrial PCBs, this machine combines intelligent temperature control, optical alignment, and automated workflows to ensure consistent, reliable results.
Core Features & Selling Points
1.Intuitive Touchscreen InterfaceThe high-definition touchscreen lets you set heating temperature, time, slope, cooling, and vacuum parameters with a few taps. It displays real-time temperature curves (set vs. measured) and offers instant curve analysis, so you can fine-tune your process on the fly.
2.Tri-Zone Independent HeatingThree independent heating zones (top, bottom, and preheat) each support 8-stage temperature control, powered by individual PID algorithms. This ensures uniform heating across the PCB, preventing warping and delivering optimal soldering results for every zone. The large preheating area keeps your PCB stable throughout the process.
3.Unlimited Profile Storage & Multilingual SupportStore up to 9999 temperature profiles for quick recall with different BGA chips. Edit and analyze curves directly on the touchscreen, and switch between English and Chinese interfaces seamlessly-perfect for global users.
4.Precision Temperature ControlA high-accuracy K-type thermocouple closed-loop system maintains temperature within ±2℃, with an external temperature port for calibration and curve verification. This level of precision is critical for delicate iphone repair machine tasks and sensitive SMD components.
5.Secure & Versatile PositioningThe V-slot PCBA holder with laser positioning ensures fast, accurate alignment, while a movable universal fixture protects your PCB from scratches and warping. It accommodates PCBs of all sizes, making this smd desoldering station adaptable to any job.
6.HD Optical Alignment SystemThe high-definition CCD camera system features light splitting, zoom, autofocus, automatic color difference detection, and brightness adjustment, achieving a positioning accuracy of ±0.01mm. This guarantees perfect alignment for even the smallest BGA chips.
6.Integrated Heating & PlacementThe top heating and placement head is motor-driven for one-touch operation. Equipped with a high-sensitivity pressure sensor, it prevents damage to the PCB or machine in case of anomalies, ensuring safe, worry-free operation.
7.Integrated Heating & PlacementThe top heating and placement head is motor-driven for one-touch operation. Equipped with a high-sensitivity pressure sensor, it prevents damage to the PCB or machine in case of anomalies, ensuring safe, worry-free operation.
8.Dual-Level Security ProtectionDual password protection prevents unauthorized changes to programs and parameters, while a voice "advance alert" sounds 5–10 seconds before the completion of desoldering or soldering, giving you time to prepare. The machine also features CE certification, an emergency stop button, and automatic power cut-off in case of temperature runaway.
9.360° Adjustable Air NozzleThe included full-air nozzle can be rotated 360° for flexible positioning, and is easy to install or replace.
10.Automatic Cooling SystemAfter heating stops, a high-power fan activates to cool the PCB to room temperature, preventing warping and extending the machine's lifespan by avoiding thermal aging.
11.Built-In Vacuum PumpNo external gas source is required-simply plug in the power cord and start working, making this automatic ic chip bga repair machine usable anywhere.
Products Parameters
| Model | DH-G620 |
| Total Power | 5500W |
| Power Supply | AC220V±10%, 50/60Hz |
| Bottom Heater | 3000W (Second Heating Zone 1200W) |
| Bottom Preheater | 3000W (Heating Plate 360×260mm) |
| Operation Mode | Automatic disassembly, welding, suction, and bonding all in one. |
| Basic Configuration | Lever/Auto Lift Desoldering System + High-Definition Camera + Suction Pen System + CCD Optical Alignment System + PLC + 7-inch Touch Screen + Guide Rail + 10-Channel Temperature Control System + Temperature Measurement System + High-Efficiency Heating Brick |
| Chip Feeding System | Manual Feeding & Loading |
| Temperature Profile Storage | 10,000 Groups |
| Optical CCD Lens | Manual Pull Out & Push Back |
| Chip Angle Adjust | Air Nozzle Rotatable 360°, Precisely Adjustable for Placement Angle up to 45 |
| Positioning | Up/Down Positionable, 5-point Support + V-Slot Fixing for PCBA; PCBA can be adjusted freely along the X/Y axis, with universal fixture |
| BGA Position | Laser Positioning for Quick Alignment to the Center Point of Bottom Heating Zone & BGA |
| Temperature Control | K-Type Thermocouple (K Sensor) Closed-Loop Control; Supports 8-20 Segment Temperature Programming |
| Temp Accuracy | ±2℃ |
| Position Accuracy | 0.01mm |
| CCD System | High-Definition CCD Camera, Auto Focus & Zoom, Laser Positioning |
| PCB Size | Max 370×380 mm, Min 10×10 mm |
| Workbench Fine-Tuning | 15mm Front/Back, 15mm Left/Right |
| BGA Chip | 1×1-80×80mm |
| Gas Source | Built-in Vacuum Pump, No External Gas Required |
| BGA Absorption Mode | Negative Pressure Suction with Automatic Release after Placement |
| Weight-bearing capacity BGA | 5-200g (Customizable for Special Specifications) |
| Minimum Chip Spacing | 0.1mm |
| External Temperature Sensor | 1 Port, Expandable (Optional) |
| Dimensions | L760 X W885 X H890 mm |
Products Details
why choose us
After years of development and focused efforts, the company possesses 78 patents and intellectual property rights, 97 quality control processes, and its products cover three major series: low, medium, and high-end. It has completed the research and development and production of products ranging from manual and semi-automatic to fully automatic. Since its establishment in 2011, the company has continuously expanded its scale and now has two major subsidiaries: "Shenzhen Dinghua Kechuang Automation Co., Ltd." and "Shenzhen Dinghua Kechuang Technology Co., Ltd."
why choose our products
With research and development as our foundation, we have a professional R&D team that continuously updates our technology to meet the demands of market development. We'll help you solve any problems you may have.
With quality as the core, imported core components ensure durability and reliable quality.
After-sales service is guaranteed, and technical support is available during the warranty period.
Let us join hands to develop, progress together, and create a better future! Thank you for your support!
Our address
4th Floor, 6B Building, Shengzuozhi Technology Park, Xinyu Road, Shajing Town, Bao'An District, Shenzhen City
Phone Number
+86 151-7443-3187
judy@dinghua-bga.com
