Xray Inspection Machine

X-Ray Inspection Machine is a non-destructive testing (NDT) system designed to inspect hidden structures and solder joints inside electronic assemblies without damaging the product. Using high-resolution X-ray imaging technology, the system can detect defects such as solder voids, bridging, cold joints, insufficient solder, and component misalignment that cannot be identified through visual inspection.

1. The X-ray source adopts a closed X-ray tube, featuring long lifespan, maintenance-free operation, and 130KV voltage.

2. The new-generation high-definition digital flat-panel X-ray inspection detector, with a high-resolution design, delivers optimal images in an extremely short time.

3. Laser automatic navigation and positioning enable quick selection of the shooting position.

4.X/Y/Z axis motion control for easy operation.

5. CNC inspection mode for fast automatic detection of multi-point arrays.

6. Tiltable angle: ±60°; multi-angle tilt inspection makes it easier to detect sample defects.

7. Optional 360° rotation function. X-ray machine for pcb

8. Visualised high-definition navigation window for convenient operation and quick location of the inspection target.

9. The industrial X-ray inspection system has a 550 mm* 550 mm loading stage. 

10. Simple and fast operation allows quick identification of target defects; users can get started after 2 hours of training.

Detectable Defects
The X-Ray Inspection Machine can identify a wide range of hidden manufacturing defects, including:

• BGA voids
• BGA bridging
• Cold solder joints
• Insufficient solder
• Excess solder
• Through-hole solder defects
• Open circuits
• Short circuits
• Cracked solder joints
• Component misalignment
• Internal PCB structural defects

X-ray Source	Type: Closed reflective target microfocus Voltage: 40-130KV (configurable)  Current: 10-300uA Max Power: 39W Microfocus Size: 5μm
Flat-Panel Detector	Type: Amorphous silicon flat-panel  Pixel Matrix: 1536×1536 Field of View: 130.56×130.56mm Spatial Resolution: ≥5.5Lp/mm  Pixel Pitch: 85μm
Loading Stage	Size: 550×550mm Inspection Range: 500×500mm Max Load: 10kg Radiation Isolation: 5mm thickened lead plate
Chassis & Electrical	Dimensions: 1450(L)×1530(W)×2000(H)mm Weight: ~1500kg  Power Supply: AC220±10% 10A Total Power: 1500W
Safety & Environment	Operating Env: 22±3℃, 50%RH±10%RH Radiation Safety: ≤1μSV/H (meets international standards)  Key Protections: Interlock, electromagnetic window lock, emergency stop
Dimensions	1450mm(L) × 1530mm(W) × 2000mm(H)
Weight	Approx. 1500kg
Power Supply	AC220±10% 10A
Total Power	1500W
Temp & Humidity	22±3℃, 50%RH±10%RH
Radiation Protection	Steel-lead-steel structure; leaded glass windowDose rate ≤1μSV/H (meets international standards)
Key Protections	1. Safety interlock (door open → X-ray disabled)2. Electromagnetic window lock (X-ray on → window locked)3. Emergency stop button (one-press power cut)
Manufacturer	Shenzhen Dinghua Innovation Automation Co., Ltd.(X-RAY / BGA rework station specialist)

Safety Interlock	3 high-sensitivity limit switches are installed at the front and rear door positions. When the door is opened, the X-ray source is automatically protected and the X-ray tube cannot be activated.
Electromagnetic Safety Door	The observation window is equipped with an electromagnetic switch. When the X-ray tube is in operation, the observation window cannot be opened.
Emergency Stop Button	In case of emergency, press to cut off power immediately.

Category	Item	Description
(General Functions)	Image Effect Adjustment	Freely adjust the image's filter level, brightness, contrast, and filter to achieve the desired image effect.
	Navigation Window	After the high-definition color camera captures the platform image, click any position on the photo to quickly locate the inspection target.
	Motion Axis Status	Displays real-time coordinates and magnification rate.
	Inspection Results	Sequentially displays each measurement result (void rate, distance, area, and other measurement items).
	Speed Control	Adjust the axis movement speed (slow, normal, fast) via the space bar and software.
Void Rate Measurement	Automatic Calculation	Measure voids in packaged components (e.g., BGA, QFN); automatically calculate the BGA void proportion in the selected area. Set thresholds to automatically determine void rate and maximum void rate.
	Parameter Adjustment	Adjust thresholds, size, Blob type, and calculation parameters to get accurate automatic calculation results.
Dimension Calculation	Through-Hole Solder Ratio Calculation	Mainly used to measure the wetting rate of through-hole components; obtain the proportion and height of the component's soldering surface via rectangular selection.
	Quick Distance Measurement	Get the distance between two points via arbitrary frame selection.
	Point-Line Distance	Get the distance between a point and a line via arbitrary point and line selection.
	Angle	Set points A and B as the baseline, then click point C to measure the included angle between rays BA and BC.
	Circle	Mainly used to measure circular components (e.g., solder balls); select any circular component via frame selection to get its circumference, area, and radius.
	Horizontal Rectangle	Mainly used to measure square components; select a square via frame selection to get its length, width, and area.

Automatic Inspection	Item	Description
	CNC Inspection	For multiple inspection points, simply set any position and measurement items; the software will automatically capture each inspection point and save the images.
	Laser Positioning	Red dot laser positioning device, dual assistance for easy navigation.