Optical Playstation BGA Rework Station

                                                                            Optical PlayStation bga rework station

1. Quick preview:

With easy to operate the system, the DH-G600 optical PlayStation bga rework station is designed with HD Optical Alignment 

system to ensure the accuracy of mounting BGA and Components and aimed to help the operator to master how to use it within 

few minutes.

If you are looking for a bga rework station for mobile phone repair, congratulation! You’ve found the original factory. Dinghua,

 maybe the best brand of bga rework station around the world.

3. The main features of the DH-G600 BGA rework station

01, "Embedded industrial computer, high-definition touch screen man-machine interface, digital system settings, intelligent man-

machine dialogue, PLC control, self-selected storage, call the temperature curve, with "temperature retention *. "Instantaneous 

curve analysis" "Welcome to remind when the demolition down" function, real-time display settings and measured temperature 

curve, and the curve can be analyzed and corrected.

02, High-accuracy K-type thermocouple closed-loop control and PID temperature automatic compensation system, combined 

with PLC operation unit and temperature module to achieve accurate temperature control, keep the temperature deviation at ± 2 

degrees while external

03, using high-precision digital video pair Bit system, HD CCD imaging, coordinate positioning, intelligent heating temperature control: 

Linear carriages are used to make x. Y, Z three axes can be used for fine-tuning or quick positioning, convenient, Holley 1-full CE board

 layout and different size PCB board positioning.

DH-G600 BGA Rework Station Real repairing performance :

The below picture shows the genuine success rate based on 20 pcs of each of the four kinds of IC. The success rate of one-time rework 

of BGA reached

 100%.

4. Detailed Images of G600 BGA REWORK STATION

HD Optical CCD Lens Alignment System

The camera is imported from Panasonic, Japan to ensure the replacement accuracy at ±0.01mm

Mounting head with built-in pressure testing device , to protect the PCB from damage.

build-in vacuum in mounting head pick up BGA chip automatically after desoldering completed

With top air flow adjust, to prevent tiny bga from blew away.

PCB Positioning: V-groove, PCB boards can be adjusted in X, and Y axis and equipped with a universal fixture

5. Advantages

Eight reasons customers choose our company:

1. Our company was founded in 2011, specializing in BGA rework station and automation solutions.

2. Our products of the brand "DINGHUA" sell well both at home and abroad.

3. We serve customers sincere, warm services, efficient and professional advice

4. Our company is a reliable "one-stop" purchasing window.

5. We adhere to the "LONGLIFE" concept of quality, making you no worry about after sale.

6. Factory supply directly, with better prices.

7. Dinghua was composed of the senior sales team and a scientific management system.

8. We have the valuable culture of "Integrity, exploration, sharing and mutual benefits

6. Packing & Delivery & Services of G600 BGA REWORK STATION

Delivery policy： Normally, it takes about 3 working days to USA and 4 days to European countries and more than 

3 days for slow expresses. We can ship as per your request and help to find the most cost-efficient and fast way.

Once upon delivery, We will send your tracking Number immediately.

7. FAQ of the G600 BGA REWORK STATION

Q: How to contact us to solve your questions?

A: Any questions,pls leave us "Inquiry""& click "Chat Now" to know more details (price & discount & free gifts) ,

I'll reply to you at the first time.

If u want to know more about our machine, please contact us, We are always ONLINE to serve your inquiry.  

Mob/WhatsApp/Wechat: +86 13652339539"

Q: How to use it?

A: 1. Don't worry. We will provide u with an English instruction book and Demo Video to see how to use it.

2. About the temperature setting, pls refer to the setting of the temperature parameters manual here and to 

see how to set the temperature

Q: Do you accept OEM orders?

A: Yes, OEM & ODM are acceptable.

8. Services

* Your inquiries related to our products will be replied to within 24 hours.

* OEM&ODM are welcome, OEM brand is available.

* Protection of your sales area, ideas for your design, and all your private information.

* View our Factory.

* Training how to install the machine, training how to use the machine.

* Engineers available to service machinery overseas.

9. Related Knowledge

Reflowing and reballing

X-ray picture of good solder joints.

Good solder joints between BGA and PCB

Ball grid arrays (BGA) and chip scale packages (CSA) present special difficulties for testing and rework, as they have many small, closely 

spaced pads on their underside which are connected to matching pads on the PCB. Connecting pins are not accessible from the top for

 testing, and cannot be desoldered without heating the whole device to the melting point of the solder.

After fabrication of the BGA package, tiny balls of solder are glued to the pads on its underside; during assembly, the balled package is 

placed on the PCB and heated to melt the solder and, all being well, to connect each pad on the device to its mate on the PCB without any

 extraneous solder bridging between adjacent pads. Bad connections produced during assembly can be detected and the assembly reworked

 (or scrapped). Imperfect connections of devices that are not themselves faulty, which work for a time and then fail, often triggered by thermal 

expansion and contraction at operating temperature, are not infrequent.