What can a BGA rework station do

BGA soldering station, also known as BGA rework station or BGA desoldering station, is a special equipment for dealing with BGA chip soldering problems. Due to the high temperature requirements for BGA chip soldering, traditional heating tools such as hot air guns cannot meet its precise temperature control needs.

The equipment adopts a three-temperature zone heating system and infrared heating technology to achieve uniform heating through synchronous upper and lower heating. It is equipped with an optical alignment system and a vacuum pump chip suction device, and supports ±2°C temperature control accuracy and real-time temperature curve display functions.

Its workflow includes a preheating section, a heat preservation section, a heating section, a welding section and a cooling section.

It can adapt to chip sizes from 0.8×0.8mm to 80×80mm, and the repair success rate exceeds 98%. Equipment is divided into three categories: manual, semi-automatic and fully automatic.
The semi-automatic model uses a dichroic prism imaging system to achieve ±0.01mm placement accuracy. Core components include upper/lower air nozzles, universal fixtures, temperature measurement interfaces and high-definition touch screens. Some models are equipped with a repair monitoring system. It is necessary to disable the two-temperature zone structure when selecting the model.

It also meets the mechanical positioning requirements for PCB thickness of 0.3-20mm, and achieves rapid alignment through V-shaped slots and laser positioning lights. When welding, you need to adjust the chip to the center of the upper and lower air outlets, and use a clamp to fix the motherboard to prevent deformation.