Chips packaged by BGA packaging process

There are four basic types of BGA: PBGA, CBGA, CCGA and TBGA. Generally, a solder ball array is connected to the bottom of the

package as an I/O terminal.

The typical pitch of the solder ball array for these packages is 1.0mm, 1.27mm, 1.5mm. The common lead-tin compositions of solder

balls are 63Sn/37Pb and 90Pb/10Sn. The diameter of solder balls varies from company to company because there is currently no corresponding standard in this regard.

From the perspective of BGA assembly technology, BGA has superior characteristics than QFP devices. This is mainly reflected in the

fact that BGA devices have less stringent requirements for mounting accuracy. Theoretically, during the soldering reflow process,
Even if the solder ball is offset by as much as 10% relative to the pad, the device position will be automatically corrected due to the

surface tension of the solder. This situation has been proven to be quite obvious through experiments.

Secondly, BGA has no longer the problem of pin deformation of devices such as QFP, and BGA also has better coplanarity than QFP

and other devices.

Its lead-out spacing is much larger than that of QFP, which can significantly reduce the problem of solder paste.
Printing defects lead to solder joint "bridging" problems; in addition, BGA also has good electrical and thermal properties, as well as
high interconnect density. The main disadvantage of BGA is that it is difficult to detect and repair solder joints.
The reliability requirements for solder joints are relatively strict, which limits the application of BGA devices in many fields.