Ball Grid Array Rework Reball Machine

Automatic Ball Grid Array Rework Reball Machine

 

1.Product Features of Automatic Ball Grid Array Rework Reball Machine

 

•High successful rate of chip-level repairing. Desoldering, mounting and soldering process is automatic.

• Convenient alignment.

•Three independent temperature heatings + PID self setting adjusted, temperature  accuracy will be on ±1°C

•Built in vacuum pump, pick up and place BGA chips.

•Automatic cooling functions.

2.Specification of Automated Ball Grid Array Rework Reball Machine

 

3.Details of Hot Air Automatic Ball Grid Array Rework Reball Machine

 

 

4.Why Choose Our Infrared Automatic Ball Grid Array Rework Reball Machine?

 

5.Certificate of Optical alignment automatic Ball Grid Array Rework Reball Machine

 

6.Packing list of Optics align CCD Camera Ball Grid Array Rework Reball Machine

 

7. Shipment of Automatic Ball Grid Array Rework Reball Machine Split Vision

We ship the machine via DHL/TNT/UPS/FEDEX, which is fast and safe.  If you prefer other terms of shipment, 

please feel free to tell us.

 

8. Payment terms.

Bank transfer, Western Union, Credit card. 

We will send the machine with 5-10 business after receiving payment.

 

9.Contact us for instant reply and best price.

Email:john@dh-kc.com

MOB/WhatsApp/Wechat:  +86 15768114827

Click the link to add my WhatsApp:

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10. Related Knowledge of Automatic Ball Grid Array (BGA) Rework/Reball Machine

FPC SMT Soldering Quality Standards:

• Normal Minimum Clearance: The component size must exceed the pad by 20µm.
• Welding Position: There should be a clearance of 1/2 of the welding position.

4. Specifications for Inspection of Welded Parts:

No.	Inspection Item	Inspection Standard	Bad Icon
4.1	Missing Parts	There should be no unwelded parts or parts falling off at the FPC solder joints.	no
4.2	Damage	Components after welding must not be damaged or notched.	no
4.3	Incorrect Parts	The model specifications of components soldered to the pads must match the engineering drawings.	no
4.4	Polarity	The direction of the welded parts must match the board instructions or engineering drawings.	no
4.5	Miscellaneous	There should be no glue, tin spots, or other debris left in the component's pin.	no
4.6	Bubbles	The package of the soldered component must not have any poor foaming.	no

5.1 Continuous Welding
There should be no short circuit between solder joints.

5.2 Welded Joints
Welded parts must not have joints that are not connected to the solder points.

5.3 Non-Fusible Solder
Parts must not have incomplete or missing solder joints.

5.4 Floating:

• 5.4.1: The solder pad height at the bottom of the connector pin must not exceed the height of the part pin. (Note: As shown in Figure T, the height of the part pin is G, the height of the solder pad tin is T, and the solder pad height during soldering cannot exceed the height of the part pin, i.e., G ≤ T.)
• 5.4.2: The height of the solder pad at the bottom of the resistor, LED, etc., should not be higher than 1/2 of the component lead height.

5.5 Solder Deficiency:

• 5.5.1: The height of the tin on the connector must be 2/3 of the pin height and must not exceed the height where the plastic part meets. (Note: As shown in Figure T, the height of the part pin is G, the height of the solder pad tin is T, and F is the normal solder point height. Therefore, F ≥ G + 2/3T.)
• 5.5.2: The lead of the resistor, LED, and other parts must have solder at least 2/3 the height of the pin.

 

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