Automatic Infrared BGA Rework Station

1.Automatic BGA Rework station for desoldering and soldering
2.Built-in infrared heating tube.
3. PID temperatures controlling and 3-heating areas to work together.

Send Inquiry

Description

1.Application Of

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP,

PBGA,CPGA,LED chip.

2.Advantage of Automatic Infrared BGA Rework station

3.Technical data of laser positioning

power	5300W
Top heater	Hot air 1200W
Bottom heater	Hot air 1200W.Infrared 2700W
Power supply	AC220V±10% 50/60Hz
Dimension	L530W670H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	K type thermocouple, closed loop control, independent heating
Temperature accuracy	±2℃
PCB size	Max 450490 mm,Min 2222 mm
Workbench fine-tuning	±15mm forward/backward,±15mm right/left
BGAchip	8080-11mm
Minimum chip spacing	0.15mm
Temp Sensor	1(optional)
Net weight	70kg

4.Structures of Infrared CCD Camera Automatic Infrared BGA Rework station

5.Why Hot air reflow Automatic Infrared BGA Rework station is your best choise?

6.Certificate of Optical Alignment

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system,

Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

pace bga rework station

7.Packing & Shipment of CCD Camera

8.Shipment for Split Vision

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.

9. Related knowledge

HDI Filter Capacitor FANOUT Case for Automatic Infrared BGA Rework Station

We know that filter capacitors are placed between the power supply and ground. They serve two main functions:
(1) Powering the IC during fast switching states, and
(2) Reducing noise between the power supply and ground.

All filter capacitor selection strategies are configured with laddered capacitance values. Large capacitors provide sufficient power reserves, while smaller capacitors have lower inductance, allowing them to meet the IC's fast charge and discharge requirements for the Automatic Infrared BGA Rework Station.

In our conventional design, when fanouting the filter capacitor, a small, thick lead wire is pulled from the pin, then connected to the power plane through a via. The ground terminal is handled similarly. The basic principle of fanout vias is to minimize the loop area, which in turn minimizes the total parasitic inductance.

The common fanout method for the filter capacitor is shown in the figure below. The filter capacitor is placed close to the power pin of the Automatic Infrared BGA Rework Station.

The function of the filter capacitor is to provide a low-impedance path for the power supply network to reject noise. As shown in the figure below (Lbelow represents the self-inductance and mutual inductance of two vias), when the capacitor is positioned closer to the IC, as indicated by the dotted line in the figure, the mutual inductance of Lbelow increases. Due to the combined effect of mutual and self-inductance, the overall inductance decreases, leading to faster charge and discharge speeds. For the Automatic Infrared BGA Rework Station, Labove includes the equivalent series inductance (ESL) of the capacitor and the mounting inductance.

Due to the parasitic inductance of the filter capacitor, the impedance of the capacitor at high frequencies increases, weakening or even eliminating its noise suppression capabilities. The decoupling range of a typical surface-mount decoupling capacitor is usually within 100 MHz.

One day, our marketing team contacted me about an issue with a new customer's consumer HDI project, asking if we could help with debugging. According to customer feedback, the schematics and layouts for their SOC-related modules were designed based on the demo board, but many functions failed to meet expectations during product testing. The demo boards worked fine; they consulted the chip manufacturer's FAE, who checked the schematics and found no issues. However, their product used a 10-layer, 3rd-order HDI design, while the demo board used an any-order HDI design. The FAE advised them to fully reference the demo board or simulate the modified parts. The customer felt that because their company wasn't well-known, the original chip FAE wasn't actively helping them. At the same time, their PCBs were designed by "more professional and experienced" PCB engineers, who found no abnormalities during inspection. Finally, they came to us to identify the problem and see if we could optimize the design to meet the performance requirements of the Automatic Infrared BGA Rework Station.

Related Products: