Laser Positioning BGA Rework Station

                                                   Automatic Laser Positioning BGA Rework Station

 

An Automatic Laser Positioning BGA Rework Station is a machine used to repair or replace damaged Ball Grid

Array (BGA) components on a printed circuit board (PCB). The station uses laser technology to accurately pos-

ition and align the BGA component during the rework process, ensuring that it is placed precisely on the PCB

and soldered properly. The use of laser positioning technology makes the process faster, more precise and red-

uces the risk of damage to the PCB or the component during the rework process.

 

 

A high-resolution camera for viewing the PCB and components

 

A precision laser alignment system

 

An adjustable heating system to control the temperature of the PCB during the rework process

 

A cooling system to control the temperature of the components and prevent damage

 

An intelligent control system to manage the entire process

 

1.Application Of laser positioning BGA rework station

Work with all kinds of motherboards or PCBA.

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, 

PBGA,CPGA,LED chip.

DH-G620 is totally same as DH-A2, automatically desoldering, pick-up, puting back and soldering for a chip, with optical alignment for mounting,no matter whether you have experience or not, you can master it in one hour.

2.Product Features of Optical Alignment Laser Positioning BGA Rework Station

 

3.Specification of DH-A2 Laser Positioning BGA Rework Station

power	5300W
Top heater	Hot air 1200W
Bottom heater	Hot air 1200W.Infrared 2700W
Power supply	AC220V±10% 50/60Hz
Dimension	L530*W670*H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	K type thermocouple, closed loop control, independent heating
Temperature accuracy	±2℃
PCB size	Max 450*490 mm,Min 22*22 mm
Workbench fine-tuning	±15mm forward/backward,±15mm right/left
BGAchip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(optional)
Net weight	70kg

 

4.Details of Laser Positioning BGA Rework Station

 

 

6.Certificate of Laser Positioning BGA Rework Station

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

 

7.Packing & Shipment of Laser Positioning BGA Rework Station with CCD Camera

 

 

8.Shipment for Laser Positioning BGA Rework Station with Optical alignment

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.

 

9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

 

11. Related knowledge

 

Wiring is the most detailed and highly skilled aspect of the PCB design process. Even engineers who have been wiring for more than ten years often feel uncertain about their wiring skills because they have encountered all kinds of problems and know the issues that can arise from poor connections. As a result, they may hesitate to proceed. However, there are still masters who possess rational knowledge and, at the same time, use their intuition to route wires beautifully and artistically.

Here are some useful wiring tips and tricks:

First of all, let's start with a basic introduction. The number of layers in a PCB can be categorized into single-layer, double-layer, and multi-layer boards. Single-layer boards are now mostly eliminated, while double-layer boards are commonly used in many sound systems, typically serving as a rough board for power amplifiers. Multi-layer boards refer to boards with four or more layers. For component density, a four-layer board is generally sufficient.

From the perspective of via holes, they can be divided into through holes, blind holes, and buried holes. A through hole passes directly from the top layer to the bottom layer; a blind hole extends from the top or bottom layer to the middle layer without continuing through. The advantage of blind holes is that their positions remain accessible for routing on other layers. Buried vias connect layers within the board and are completely invisible from the surface.

Before automatic wiring, wires with higher requirements should be pre-wired in advance. The edges of the input and output ends should not be adjacent to avoid reflection interference. If necessary, ground wires can be isolated, and the wiring of two adjacent layers should be perpendicular to each other, as parallel wiring is more likely to cause parasitic coupling. The efficiency of automatic wiring depends on a good layout, and wiring rules can be set in advance, such as the number of wire bends, via holes, and routing steps. Generally, exploratory wiring is performed first to quickly connect short circuits, and the routing is optimized through a labyrinth layout. This allows for disconnection of laid wires and re-routing as needed to improve the overall wiring effect.

For layout, one principle is to separate signals and simulations as much as possible; specifically, low-speed signals should not be close to high-speed signals. The most basic principle is to separate the digital ground from the analog ground. Since the digital ground involves switching devices, which can draw large currents during switching moments and smaller currents when inactive, it cannot be mixed with the analog ground.