SMD BGA Rework Station Automatic

                                                                                     SMD BGA rework station automatic

This is a mature machine with perfect experiences, the customers who bought the machine DH-A2 to its satisfaction

rate is up to 99.98%, which were widely used in car, computer and mobile phone industries, more than 1 million customers

 are using.

1.Application of a SMD BGA rework station automatic

To solder, reball, desolder a different kind of chips: 

BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chips.

2. Product Features of a SMD BGA rework station automatic

* Stable and long lifespan(designed for 15 years using)

* Can repair different motherboards with high successful rate

* Strictly control heating and cooling temperature

* Optical alignment system: mounting accurately within 0.01mm

* Easy to operation. Can learn to use in 30 minutes. No special skill is needed.

3. Specification of SMD BGA rework station automatic

4. Details of SMD BGA rework station automatic

1. Top hot-air and a vacuum sucker installed together, which is conveniently picking up a chip/component for aligning.

2. Optical CCD with a split vision for those dots on a chip vs motherboard imaged on a monitor screen.

3. The display screen for a chip(BGA,IC,POP and SMT,etc.) vs its matched motherboard's dots aligned before soldering.

4. 3 heating zones, upper hot-air, lower hot-air and IR preheating zones, which can be used for small to iPhone motherboard, 

also, up to computer ann TV mainboards, etc. 

5. IR preheating zone covered by steel-mesh, which heating evenly and safer.

5. Why Choose Our Automatic SMD BGA rework station automatic? 

6.Certificate of Automatic BGA rework reballing machine

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

7. Packing & Shipment of Automatic SMD BGA rework station automatic

8. Shipment for Automatic SMD SMT LED BGA Workstation

DHL/TNT/FEDEX. If you want other shipping terms, please tell us. We will support you.

9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

10. Operation guide for Automatic SMD SMT LED BGA Workstation

11. The relevant knowledge for a SMD BGA rework station automatic

How to program a temperature profile :

At present, there are two kinds of tin commonly used in SMT: lead, tin, Sn, silver, Ag, copper and Cu. The melting point of sn63pb37 

with lead is 183 ° and that of sn96.5ag3cu0.5 without lead is 217 °

3. When adjusting the temperature, we should insert the temperature measuring wire between BGA and PCB, and make sure that 

the exposed part of the front end of the temperature measuring wire is inserted. A kind of

4. During ball planting, a small amount of solder paste shall be applied on the surface of BGA, and the steel mesh, tin ball and ball 

planting table shall be clean and dry. 5. Solder paste and solder paste should be stored in the refrigerator at 10 ℃. A kind of

6. Before making board, make sure PCB and BGA are dry and baked without moisture. A kind of

7. The international environmental protection mark is Ross. If the PCB contains this mark, we can also think that the PCB is made by 

lead-free process. A kind of

8. During BGA welding, evenly apply solder paste on PCB, and slightly more can be applied during lead-free chip welding. 9. When 

welding BGA, pay attention to the support of PCB, do not clamp too tightly, and reserve the gap of PCB thermal expansion. 10. The 

main difference between lead tin and lead-free tin: the melting point is different. (183 ℃ lead-free 217 ℃) lead mobility is good, lead

-free poor. harmfulness. Lead free means environmental protection, lead free means environmental protection

11. The function of soldering paste 1 > soldering aid 2 > removing impurities and oxide layer on the surface of BGA and PCB, making

 the welding effect better. 12. When the bottom dark infrared heating plate is cleaned, it cannot be cleaned with liquid substances. It

 can be cleaned with dry cloth and tweezers!

Temperature adjustment details: the general repair curve is divided into five stages: preheating, temperature rise, constant temperature, 

fusion welding and back welding. Next, we will introduce how to adjust the unqualified curve after testing. Generally, we will divide the 

curve into three parts.    

1. The preheating and heating section in the early stage is a part, which is used to reduce the temperature difference of PCB, remove

   moisture, prevent foaming, and prevent thermal damage. The general temperature requirements are: when the second period of

   constant temperature operation is over, the temperature of tin we test should be between (lead-free: 160-175 ℃, lead: 145-160 ℃),

   if it is too high, it means that we set the temperature rise If the temperature in the heating section is too high, the temperature in the

   heating section can be reduced or the time can be shortened. If it is too low, Increase the temperature or increase the time. If the PCB

   board is stored for a long time and not baked, the first preheating time can be longer to bake the board to remove moisture.    

   
   

2. The constant temperature section is a part. Generally, the temperature setting of the constant temperature section is lower than that of 

the heating section, so as to keep the temperature inside the solder ball rising slowly to achieve the constant temperature effect. The function 

of this part is to activate the flux, remove the oxide and surface film and the volatiles of the flux itself, enhance the wetting effect and reduce 

the effect of temperature difference. The actual test temperature of tin in the general constant temperature section should be controlled at 

(lead-free: 170-185 ℃, lead 145-160 ℃). If it is too high, the constant temperature can be reduced a little, if it is too low, the constant tempe-

rature can be increased a little. If the preheating time is too long or too short according to our measured temperature, it can be adjusted by 

lengthening or shortening the constant temperature period.

If the preheating time is short, it can be adjusted in two cases:

1. After the end of the second stage (heating stage) curve, if the measured temperature does not reach 150 ℃, the target temperature (upper and lower curves) in the second stage temperature curve can be increased appropriately or the constant temperature time can be extended appropriately. It is generally required that the temperature of the temperature measuring line can reach 150 ℃ after the operation of the second curve. A kind of

   
   

2. After the end of the second stage, if the detection temperature can reach 150 ℃, the third stage (constant temperature stage) should be extended. 

The preheating time can be extended as many seconds as less.      

How to deal with the short back welding time:

1. The constant temperature time of the back welding section can be increased moderately, and the difference can be increased as many seconds as possible

En la actualidad, hay dos tipos de estaño comúnmente utilizados en SMT: plomo, estaño, Sn, plata, Ag, cobre y Cu. El punto de fusión de sn63pb37 con plomo es 183 ° y el de sn96.5ag3cu0.5 sin plomo es 217 °

3. Al ajustar la temperatura, debemos insertar el cable de medición de temperatura entre BGA y PCB, y asegurarnos de que la parte expuesta del 

extremo frontal del cable de medición de temperatura esté insertada. Una especie de

4. Durante la siembra de bolas, se aplicará una pequeña cantidad de pasta de soldadura sobre la superficie de BGA, y la mesa de siembra de malla de 

acero, bolas de estaño y bolas debe estar limpia y seca. 5. La pasta de soldadura y la pasta de soldadura deben almacenarse en el refrigerador a 10 ℃. 

Una especie de

6. Antes de hacer la placa, asegúrese de que el PCB y el BGA estén secos y horneados sin humedad. Una especie de

7. La marca internacional de protección del medio ambiente es Ross. Si el PCB contiene esta marca, también podemos pensar que el PCB está hecho 

por un proceso sin plomo. Una especie de

8. Durante la soldadura BGA, aplique uniformemente pasta de soldadura en PCB, y se puede aplicar un poco más durante la soldadura de viruta sin 

plomo. 9. Al soldar BGA, preste atención al soporte de PCB, no lo apriete demasiado, y reserve el espacio de expansión térmica de PCB. 10. La 

principal diferencia entre el estaño y el estaño sin plomo: el punto de fusión es diferente. (183 ℃ sin plomo 217 ℃) la movilidad del plomo es buena, 

sin plomo pobre. nocividad Sin plomo significa protección del medio ambiente, sin plomo significa protección del medio ambiente

11. La función de soldadura en pasta 1> ayuda para soldar 2> eliminando impurezas y capa de óxido en la superficie de BGA y PCB, mejorando el efecto

 de soldadura. 12. Cuando se limpia la placa calefactora infrarroja oscura inferior, no se puede limpiar con sustancias líquidas. ¡Se puede limpiar con un paño seco y pinzas!

Detalles de ajuste de temperatura: la curva de reparación general se divide en cinco etapas: precalentamiento, aumento de temperatura, temperatura constante, soldadura por fusión y soldadura por retroceso. A continuación, presentaremos cómo ajustar la curva no calificada después de la prueba. En general, dividiremos la curva en tres partes.