BGA IC Chip Remover Tool

                                                                              Automatic BGA IC Chip Remover Tool

1.Application Of laser positioning BGA IC Chip Remover Tool

Work with all kinds of motherboards or PCBA.

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, 

PBGA,CPGA,LED chip.

2.Product Features of CCD Camera BGA IC Chip Remover Tool

3.Specification of DH-A2 BGA IC Chip Remover Tool

4.Details of Automatic BGA IC Chip Remover Tool

5.Why Choose Our Hot Air Infrared BGA IC Chip Remover Tool? 

6.Certificate of BGA IC Chip Remover Tool

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, 

Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

7.Packing & Shipment of Solder Rework Station Hot Air Infrared

8.Shipment for Solder Rework Station Hot Air Infrared

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.

9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

10. How DH-A2 Solder Rework Station Hot Air Infrared?

11. Related knowle

SiS 620 chipset

The SiS 620 is the first integrated chipset from the SiS family. The chipset supports the P6 bus protocol and supports 

the Celeron/Pentium II/Pentium III. The Northbridge integrates a separate 64-bit 2D/3D graphics processor, the SiS 

63 26. Choose external 2MB, 4MB or 8MB synchronous memory and support 230MHz RAMDAC. UMA (Unified Storage

 Structure) can use main memory as frame buffer. It also supports LCD output. 2D performance is better, but 3D performance

 is weak, so it can't be supported by individual users, but it is used in commercial field. More extensive.

SiS 630 chipset

Following the SiS620, SiS has introduced a highly integrated, high-performance SiS630 series (including 630, 630E, 630S). 

The SiS630 series chipset is highly integrated. It combines the South and North Bridge chips into one and integrates the 3D 

graphics chip SiS300/301. The SiS 300/301 is a true 128-bit 3D graphics acceleration engine that supports many 3D effects. 

It is said to be five times faster than the SiS 6326, and its performance is roughly equivalent to NVIDIA's TNT2 graphics card. 

In addition, the SiS 301 can also be connected to a second CRT display or TV to meet the different needs of users.

SiS650 chipset

The SiS650 chipset is mainly composed of the North Bridge chip SiS650 and the South Bridge chip SiS961. It supports DDR333, 

DDR266 and PC133 memory, up to 3GB memory capacity, supports the new generation Pentium4, and uses SiT's original MuTIOL

 technology to provide up to 533M/s. The ultra-high bandwidth is connected to the South Bridge SiS961. Moreover, it integrates 

SiS315, a 256-bit 2D\3D graphics chip developed by SiS, and has a display memory data bandwidth of up to 2GB/s. And the South 

Bridge SiS961 chip has powerful functions, support AC'97 sound card, 10 / 100M adaptive Ethernet card, V.90Modem, 6 sets of PCI 

slots and 6 USB interfaces, etc., in terms of its function is stronger than its previous launch Integrated chipset.

SiS 730S chipset

The SiS 730S is the industry's first integrated single chip to support the AMD Athlon processor platform. Compared with the SiS 630, 

there is no change except for the processor interface protocol. The SiS 730S combines a BGA (672-pin) packaged Northbridge logic chip, 

SiS 960 Super South Bridge chip and 128-bit SiS 300 graphics chip into a single chip. Supports 3D stereo glasses, DVD hardware acceleration 

and dual display output, as well as built-in 3D stereo sound, 56kbps Modem, 100Mbps Ethernet card (Fast Ethernet), 1/10Mbps Home 

Network (Home PNA), ATA/100 interface, ACR interface, In addition, up to 2 USB controllers for 6USB device access. The chip is specifically

 designed to be upgraded to the AGP 4X interface to meet the additional needs of consumers. The shared memory design can allocate up to 

64MB of memory in the main memory as the display buffer of the SiS 300 (the shared capacity can be selected between 4/8/16/32/64MB). 

The SiS 730S with 3GB of memory can be accessed using up to three DIMM slots, up to a single 512MB SDRAM.