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BGA

BGA Repair Machine

DH-G600 is a cost-effective BGA repair machine designed for all types of PCB motherboard repair. This automatic BGA rework station features three independent temperature zones—top hot air, bottom heater, and infrared preheating—for precise and stable soldering and desoldering.

Description

Products Description

 

 

The DH-G600 model is a reasonably priced BGA repair machine, which among the others is the best option for all kinds of PCB motherboard repair. This BGA rework station is automatic, and it has three independent heating zones-top heater, bottom heater, and infrared preheating-which allow for accurate and stable soldering and desoldering.

 

Optical alignment BGA station DH-G600 (manual camera positioning) also have HD touch-screen control, an automatic cooling system, and a vacuum suction pickup, all of which contribute to the automatic BGA rework station DH-G600's performance in terms of precise alignment and secure chip removal. A perfect option for the pros who want to get the maximum performance at the lowest possible cost.

 

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Products Specification

 

 

 

Item
Parameter
Power supply
AC220V±10% 50/60Hz
Total power
5600W
Top heater
1200W
Bottom heater
1200W
Infrared heater
3000W
Dimensions
L610*W920*H885 mm
PCB size
Max 390×360 mm Min 10×10mm
BGA chip
1*1-50*50 mm
External temperature sensor
1 pc (optional)
Temperature accuracy
±2℃
Net weight
65kg
Temperature control
K Sensor, closed loop
Minimum chip spacing
0.15mm
Chip feeding system
Manually feeding and receiving
Gas source
Built-in vacuum pump, no external gas source
Optical CCD lens
Pull out and push back manually
Positioning
V-shaped groove fixing the PCBA which can be adjusted freely along the X-axis direction, and universal fixtures are provided
externally
CCD system
HD CCD digital camera, optical alignment, laser positioning

 

 

 

Operation procedures

 

1. Desoldering (The Removal Process)

Desoldering is the controlled melting of existing solder to safely remove a faulty chip from the PCB without damaging the delicate copper pads.

 

Preheating: The station's bottom IR preheater warms the entire PCB. This prevents the board from warping and reduces the "thermal shock" when the top heater starts.

 

Targeted Heating: The top hot air nozzle moves over the BGA chip and follows a programmed curve, reaching the melting point of the solder.

 

Reflow & Lift: Once the solder balls reach a fully molten (liquid) state, the station's internal vacuum pump automatically activates. The suction nozzle descends, grips the chip, and lifts it away from the board.

 

Site Preparation: After removal, the remaining "old" solder on the PCB must be cleaned using a soldering iron and desoldering wick (braid) to create a flat surface for the new chip.

 

2. Soldering (The Installation Process)

Soldering is the process of bonding a new or "reballed" chip to the PCB pads to create a permanent electrical and mechanical connection.

 

Flux Application: A thin, even layer of "tacky flux" is applied to the PCB pads.This removes oxidation and helps the solder flow and "wet" the pads correctly.

 

Optical Alignment: This is where the DH-A2E's CCD camera is critical. You use the micrometer to align the image of the chip's solder balls with the image of the PCB pads until they overlap perfectly on the screen.

 

Placement: The machine precisely lowers the chip onto the fluxed pads.

 

Reflow Soldering: The station executes a specific soldering profile.It heats the balls until they melt and "collapse" slightly onto the pads. The surface tension of the molten solder actually helps the chip self-center.

 

Cooling: After the peak temperature is held for 30–60 seconds, the heaters turn off, and the cross-flow fans activate to solidify the joints quickly, creating a strong, shiny connection.

 

 

product-852-387

 
 

Products features

 

 

1. High-definition optical alignment system, accurate chip placement alignment, guaranteed repair success;

2. Automatic to de-solder,pick-up, replace and visible mounting; joystick(when manual) to de-solder, pick up and replace to solder.
3. The three-temperature-zone can independently control the temperatures and can be combined arbitrarily to solve various chip repaired problems;
4. Precise heating control system, no effect on other devices on the motherboard when heating;
5. Extended the infrared heating area to preheat the PCB, and the motherboard will not be deformed after repair;
6. Touch screen operation, real-time display and automatic analysis of repair data, make you into a technical master in seconds;
8.Suitable for a variety of chip rework(POP,SOP,SOJ,QFP,QFN,BGA,PLCC,SCP.....)

 

 

Our Company

 

 

product-800-501

who we are?

SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO., LTD is a leading manufacturer specializing in soldering equipment. Our product range includes BGA rework stations, automatic soldering machines, automatic screwdriving machines, soldering kits, and SMT materials.


Committed to excellence, our mission revolves around research, quality, and service, aiming to provide professional equipment, quality, and service. With over 38 patents, we have innovated manual, semi-auto, and automatic series, marking a transition from traditional hardware to integrated control.

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