PCB Xray Machine

 

Dinghua PCB Xray machine DH-X7 is a high-precision automated X-ray inspection machine used to inspect the internal structure of electronic components and assemblies without causing any damage. It uses X-ray imaging technology to penetrate materials and create detailed internal images, allowing operators to see hidden defects that are invisible to the naked eye.

 

 

 

 

Whole machine status
Dimension	1100*1200*2100mm		Power supply	AC220V 10A
Weight	Appro 1200kg		Gross weight	About 1300kg
Packing	1300*1400*2200mm		Rated power	1000w
Open way	Manually		Inspection	Off-line
Uploading	Labor		Authorization	Password

 

Xray tube
Type	Sealed		Current	200uA
Voltage	90KV		Focal spot size	5um
Cooling	Wind		Geometry magnification	300times

 

 

Industrial computer
Display	24-inch HD monitor		Operation system	Windows10 64bits
Operation method	kryboard/mouse		Hard disk/memory	1TB/8G

 

 

 

 

 

 

The inspection capabilities of SMT X-ray inspection equipment:

 

1. Advanced Semiconductor & Component Level Inspection

Beyond basic visibility, SMT X-ray inspection equipment are critical for identifying internal structural integrity in high-density components.

BGA, CSP, and Flip-Chip: Detailed analysis of solder ball diameter, circularity, and placement. Detecting "Head-in-Pillow" (HiP) defects and internal bridging.

QFN/QFP and Fine-Pitch Leads: Inspection of "toe" and "heel" fillets and detecting solder splashing under the component body.

Wafer-Level Packaging (WLP): Identification of micro-cracks, TSV (Through-Silicon Via) integrity, and bumping defects.

Die Attach & Encapsulation: Assessing the uniformity of epoxy/adhesive layers and detecting delamination or air bubbles in TPU and plastic encapsulations.

 

2. Electromechanical & Passive Component Analysis

X-ray allows for the inspection of internal "blind" features that optical systems cannot reach.

Sensors & MEMS: Verifying the alignment of internal diaphragms, moving parts, and micro-mirrors without breaching the hermetic seal.

Capacitors & Resistors: Detecting internal dielectric layers, electrode alignment, and termination integrity in MLCCs.

Fuses & Heater Wires: Inspection of the continuity and gauge of internal elements to prevent "open circuit" failures in thermal management systems.

Optical Fiber & Probes: Ensuring precise core alignment and detecting micro-fractures in the cladding or connector ferrules.

 

3. High-Precision Interconnects & Welding

X-ray is the gold standard for non-destructive testing (NDT) of metal-to-metal bonds.

Metal Weldments & Solder Joints: Measuring penetration depth, porosity, and structural fusion in critical mechanical joints.

Wire Bonding: Detecting "sweep" (deformation of gold/aluminum wires) during the molding process and verifying bond pad contact.

Probe & Connector Pins: Checking for pin deformation, plating thickness consistency, and seating depth in high-density connectors.

 

4. Quality Control & Traceability Features

Modern AXI (Automated X-ray Inspection) systems integrate data processing with imaging.

Volumetric Voiding Calculation: Automated calculation of voiding percentages against IPC standards to ensure thermal and electrical conductivity.

Dimensional Metrology (Metal Height): Precise Z-axis measurement for component height, solder paste volume, and heat sink standoff.

Automated Traceability (QR/Barcode): Integrated scanners link X-ray inspection images directly to the serial number of the PCBA for 100% data traceability.

 

 

 

 

 

 

1, Standard Export Wooden cases;
2, Delivery in 2 workdays after payment confirm;
3, Fast delivery options include FedEx, DHL, UPS etc , or by air or by sea;
4, Loading port: Shenzhen or Hongkong.

 

If you have any further questions or require assistance, please do not hesitate to contact us. We would be more than happy to help you!