
Semi Automatic Optical Camera BGA Reballing Machine
Dinghua DH-A2 Semi-Automatic BGA Rework Station. Optical Camera. Hot air and infrared heating. 100% safety system.
Description
Semi-Automatic Optical Camera BGA Reballing Machine


1. Product Features of Semi-Automatic Optical Camera BGA Reballing Machine

• High degree of automation.
•High successful rate of repairing due to precise temperature control and precise alignment of every soldering joint.
•Two hot air heating zones and one infrared preheating zone create even and focused heating.
•Temperature is controlled strictly. PCB won't crack or turn yellow because temperature rises gradually.
2.Specification of Semi Automatic Optical Camera BGA Reballing Machine
| Power | 5300w |
| Top heater | Hot air 1200w |
| Bottom heater | Hot air 1200W. Infrared 2700w |
| Power supply | AC220V±10% 50/60Hz |
| Dimension | L530*W670*H790 mm |
| Positioning | V-groove PCB support, and with external universal fixture |
| Temperature control | Ktype thermocouple,closed loop control,independent heating |
| Temperature accuracy | ±2℃ |
| PCB size | Max 450*490 mm, Min 22 *22 mm |
| Workbench fine-tuning | ±15mm forward/backward,±15mm right/left |
| BGA chip | 80*80-1*1mm |
| Minimum chip spacing | 0.15mm |
| Temp Sensor | 1(optional) |
| Net weight | 70kg |
3.Details of Semi-Automatic Optical Camera BGA Reballing Machine



4.Why Choose Our Semi Automatic Optical Camera BGA Reballing Machine?


5. Certificate of Semi-Automatic Optical Camera BGA Reballing Machine
UL, E-MARK, CCC, FCC, CE, and ROHS certificates. In addition, to enhance and improve the quality system, Dinghua has passed ISO, GMP, FCCA, and C-TPAT on-site audit certification.

6.Packing for Semi-Automatic Optical Camera BGA Reballing Machine

7. Shipment of Semi-Automatic Optical Camera BGA Reballing Machine
Fast and safe DHL/TNT/UPS/FEDEX
Other shipment terms are acceptable if you need.

8. Payment terms for Semi-Automatic Optical Camera BGA Reballing Machine.
Bank transfer, Western Union, Credit card.
Shipment will be arranged with 5-10 business after placing orders.
9. Related Knowledge About Motherboard Repair
Step 1: Cleaning
The first thing to note is that dust is one of the biggest enemies of the motherboard. It is essential to keep the motherboard free from dust. Use a brush to gently remove the dust from the motherboard. Additionally, some cards on the motherboard and chips have pins, which can often lead to poor contact due to oxidation. Use an eraser to remove the surface oxide layer and then reinsert the cards. You can also use trichloroethane-a volatile liquid commonly used for cleaning motherboards. In case of a sudden power failure, you should immediately turn off the computer to avoid damaging the motherboard or power supply.
Step 2: BIOS
Improper BIOS settings, such as overclocking, can cause problems. If necessary, you can reset the BIOS or clear the settings. If the BIOS is corrupted (e.g., due to a virus), you can rewrite the BIOS. Since the BIOS cannot be measured by instruments and exists in software form, it is a good practice to update the motherboard BIOS to eliminate potential issues.
Step 3: Plug and Swap Exchange
There are many reasons a host system might fail, such as a malfunctioning motherboard or faulty cards on the I/O bus. The "plug-and-swap" method is a simple way to determine whether the fault lies with the motherboard or an I/O device. This involves shutting down the system and removing each plug-in board one by one, running the system after each removal to observe the machine's behavior. If the system runs normally after removing a particular board, then the fault lies with that board or its corresponding I/O bus slot. If the system still doesn't start properly after all the boards have been removed, the fault is likely with the motherboard itself. The "swap" method involves exchanging a faulty plug-in board with an identical one that has the same bus mode and function. By observing changes in the fault symptoms, you can pinpoint the issue. This method is commonly used in plug-and-play maintenance environments, such as when diagnosing memory errors. In such cases, swapping the memory chip or module can help identify the cause of the failure.
Step 4: Visual Inspection
When dealing with a faulty motherboard, start by visually inspecting it to look for signs of damage. Check for any burn marks or physical damage. Look for misaligned plugs and sockets, resistors and capacitor pins that may be touching, or cracks on the chip surface. Also, inspect whether the copper foil on the motherboard is damaged or if any foreign objects have fallen between components. If you have any doubts, you can use a multimeter to measure various components. Touch the surface of some chips; if they feel unusually hot, you may want to try replacing the chip.
(1) If there is a broken connection, you can use a knife to scrape off the paint from the broken line, expose the wire, and apply wax. Then, use a needle to follow the trace and remove the wax. After that, apply silver nitrate solution to the exposed wire. Use a multimeter to confirm whether the break has been properly repaired. Take care to do this step by step-since the traces on the motherboard are very small, a careless mistake could cause a short circuit.
(2) If an electrolytic capacitor is faulty, you can replace it with a matching one.







