Semi Automatic Optical Alignment BGA Reballing Machine

The Automatic Optical Alignment BGA Reballing Machine is a high-precision device used for reballing BGA chips with automated alignment. It uses advanced optical systems to accurately position chips and stencils, ensuring perfect solder ball placement. The machine automates the key steps of reballing, including flux application, ball placing, and reflow heating. It is ideal for professional repair centers and electronics manufacturing.

 

1. Product Features 

• Semi-automatic system with automatic removal, mounting, and soldering.
• Optical camera ensures precise alignment of every solder joint.
• Three independent heating zones control temperature accurately.
• No damage to PCB or chips. A built-in pressure sensor in the top head automatically stops the head if it detects any pressure during descent.
• Temperature is strictly controlled. The PCB won't crack or turn yellow because the temperature rises gradually.

2. Specification 

Power	5300W
Top heater	Hot air 1200W
Bottom heater	Hot air 1200W. Infrared 2700W
Power supply	AC220V±10% 50/60Hz
Dimension	L530*W670*H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	K-type thermocouple, closed-loop control, independent heating
Temperature accuracy	±2℃
PCB size	Max 450*490 mm, Min 22＊22 mm
Workbench fine-tuning	±15mm forward/backward.+15mm right/left
BGA chip	80＊80-1＊1 mm
Minimum chip spacing	0.15mm
Temp Sensor	1 (optional)
Net weight	70kg

 

 

3.Details of Semi Automatic Optical Alignment BGA Reballing Machine

 

4.Why Choose Our Semi Automatic Optical Alignment BGA Reballing Machine?

 

5. Certificate

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, Dinghua has

passed ISO, GMP, FCCA, and C-TPAT on-site audit certification.

6. Packing 

7. Shipment of Semi-Automatic Optical Alignment BGA Reballing Machine

Fast and safe DHL/TNT/UPS/FEDEX

Other shipment terms are acceptable if you need.

8. Payment Terms for Semi-Automatic Optical Alignment BGA Reballing Machine

Payment methods: Bank transfer, Western Union, credit card.
Shipment will be arranged within 5–10 business days after the order is placed.

 

9. Related Knowledge About Motherboard Repair

As a professional hardware technician, motherboard repair is one of the most important tasks. When dealing with a faulty motherboard, how can you determine which component is malfunctioning?

Common causes of failure include:

• Man-made faults: For example, inserting I/O cards while powered on, or damage to interfaces and chips caused by improper force when installing boards or connectors.
• Poor environment: Static electricity often damages chips on the motherboard (especially CMOS chips).
• Power supply issues: Damage from power surges or spikes in grid voltage often affects chips near the power input of the system board.
• Dust accumulation: Excessive dust on the motherboard can cause signal short circuits.
• Component quality issues: Damage caused by poor-quality chips or other components.