Automatic BGA Rework Machine

Automatic BGA Rework Machine

This automatic BGA rework machine features automatic control of heating, alignment, soldering, and placement processes, significantly reducing operator error and improving repair efficiency. Its upper and lower heaters can move freely and independently, allowing flexible positioning and making chip heating and reworking much more convenient.

Description
 

Products Description

 

 

The Automatic BGA Rework Machine DH-A6 is an high-end repairing machine made for the effective rework of Ball Grid Array (BGA) and Surface Mount (SMT) components on printed circuit boards (PCBs). With an optical positioner by CCD camera, the precise placement of chips is made sure by showing the solder balls and the PCB pads to the user and positioning them exactly in real time.


This BGA rework machine is automatically controlled during the process for heating, alignment, soldering, and placement, greatly minimizing operator error and maximizing repair efficiency. The upper and lower heaters are able to freely and autonomously move, with the position being flexibly positioned, making chip rework and chip heating greatly more convenient.


This professional-level system combines multiple temperature zones, infrared-hydro hot-air hybrid heaters, and up-to-the-minute temperature curve displays for even distribution and consistent soldering performance. It is found across the industry for high-value PCB repair work on laptops, smartphones, industrial control boards, and communications.

 

Key Features & Advantages:

1. CCD Optical Alignment System → Delivers high-precision chip-to-pad alignment.

2. Automatic Operation → Reduces manual errors and ensures consistent rework quality.

3. Upper & Lower Heaters with Free Movement → Flexible positioning for convenient and efficient chip heating.

4. Multiple Temperature Zones → Independent control of top, bottom, and preheating zones for stable reflow.

5. HD Touch Screen Interface → Simple operation with real-time process monitoring.

6. Vacuum Pick-Up System → Safe and easy handling of BGA and SMT components.

7. Infrared + Hot Air Heating → Ensures even heat distribution and prevents PCB damage.

 

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Products Specification

 

 

 

Item
Parameter
Power Supply
AC220V±10% 50/60Hz
Rated Power
6800W
Top heater
1200W
Bottom heater
1200W
IR preheating area
4200W (Germany heating tube, heating area of 500*350mm)
Operation mode
Fully automatically disassemble,suction,mounting and soldering
Chip feeding system
Automatic receiving, feeding, automatic induction (optional)
Temperature profile storage
50000 groups
Temperature control
K-type Sensor,Closed loop and 8~20 segments for temperature controlling program
Temperature accuracy
±1 ℃
Placement Accuracy
+/-0.01mm
Safety guard
pressure sensor +emergency knob,double-guard
PCB size
Max490*550 mm Min 10*10 mm
PCB thickness
0.2-15mm
BGA chip
1x1-65*65mm
Minimum chip spacing
0.15mm
External Temperature Sensor
5 pcs(optional)
Machine type
Desktop table (optional)
Dimensions
L970*W850*H950 mm

 

 

 

Product Features

 

 

 

1. High definition touch screen human-machine interface, PLC control, heating temperature, time, slope, cooling and vacuum are all set on the human -machine interface, displaying the set and measured temperature curves in real time, and has an instant curve analysis fuction to analyze and correct the curve in real time.
 
2. It can store 9999 sets of temperature curves and adjust them at any time according to different BGAs. Curve analysis, settings and corrections can also be performed on the touch screen, Chinese and English interfaces are available to facilitate barierr-free use by demostic and foreign customer.
 
3. High-precision K-type thermocouple closed-loop control and automatic temperature compensation system, combined with PLC and temperature module, achieve precise temperature control and keep the temperature deviation within ±1 degree. Five external temperature mesurement interfaces are installed to detect multiple points in the heating area at the same time. 
 
4. During the alignment process, the upper heater and lower heater can be controlled to move freely forward, backward, left and right, and the alignment status served in an all-round way to ensure the accuracy of the alignment. After the repair is completed, the PCB can also be observed in an all-round way to prevent and eliminate "observation blind spots" problems arise.
 
5. Intergrated design of upper heating and placement, placement heating is automatically completed, and the placement head rotates 360 degree electrically, making it flexible and convenient.
 
6. It has double password protection to prevent programs and parameters from being abitrarily modified or accidentally deleted, and has excellent security protection functions.
 
7. Equipped with various specifications of alloy air nozzles, which can be rotated and positioned 360 degrees and are easy to install and replace.
 
8. After the upper and lower hot air stops heating, the cooling system automatically starts. The high-power cross-flow fan quickly cools the pcb board to prevent the PCB board from deforming. After the temperature drops to normal temperature, the cooling system automatically stops to ensure that the machine will not age after the heat rises, effectively extend equipment life.
 
9. Equipped with an intelligent automatic feeding system, with functions such as automatic picking, feeding, telescopic movement of the camera.
 
10. Multiple temperature zones, upper and lower, are heated independently. Both the upper and lower temperature zones can be set to 8-segment temperature control. The three temperature zones use independent PID algorithms to control the heating process to ensure that different temperature zones are synchronized to achieve the best welding effect. The lower temperature zone adopts electric lifting to easily avoid the components at the bottom of the PCB.
 
11. The important high-definition industrial CCD high-precision digital video system has the function of light splitting, amplification, reduction and auto-focus, and is equipped with automatic color diference resolution and brightness adjustment devices to achieve preise alignment with an accuracy of ±0.01mm, ensuring that the element precise placement of components.
 
 

Detail Pictures

 

 

 

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Company Profile

 

 

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 SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO., LTD is a national high enterprise integrating the R&D, production, sales and service of X-ray counting machine, X-ray NDT machines, BGA rework stations, and automation equipment! We have absolute strength to provide you with high-quality products, perfect services and advanced technical support.


Our product range includes BGA rework stations, automatic soldering machines, automatic screwdriving machines, soldering kits, and SMT materials. Committed to excellence, our mission revolves around research, quality, and service, aiming to provide professional equipment, quality, and service.

Our products enjoy global recognition, being exported to over 80 countries and regions. Dinghua has established a robust sales network and terminal services system, making them a pioneer and guide in the SMT soldering industry.


Our products find applications in diverse sectors like individual maintenance, industrial and mining enterprises, teaching and research, military manufacturing, and aerospace, earning a good reputation among users. Believing that clients' successes is our own, Dinghua strives to work together to build a better future.

 

Certification

 

 

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