DH-5830 BGA Rework Station

The DH-5830 Touch Screen BGA Rework Station is a professional rework system designed for the removal, reballing, replacement, and soldering of BGA, QFN, CSP, and other surface-mount components.

Featuring hot air and infrared heating technology, precise temperature control, and a touch screen interface, the machine helps repair engineers achieve stable and repeatable rework results while minimizing PCB damage.

 

1	Power	4800W
2	Top heater	Hot air 800w
3	Bottomheater	Hot air 1200W,Infrared 2700w
4	Power supply	AC220V±10%,50/60HZ
5	Dimenssion	L560*W650*H580mm
6	Positioning	V-groove PCB support,and with external universal fixture
7	Temperature control	K type thermocouple,dosed loop control,independent heating
8	Temperature accuracy	±2℃
9	PCB size	Max 420*400 mm,Min 22*22 mm
10	Workbench fine-tune	±15 mm forward/backward,±15 mm right/left
11	BGA chip	2*2-80*80mm
12	Minimum chip spacing0.15 mm	0.15mm
13	Temp sensor	1(optional)
14	Net Weight	31 KG

1, High-Precision Adjustment:
Equipped with a slider mechanism, allowing all three axes (X, Y, and Z) to be finely tuned and quickly positioned. This ensures excellent positioning accuracy and maneuverability.

2, Touch Screen Operation
Features a touch panel interface and PLC control system to ensure stable and reliable operation. It supports the storage of multiple temperature profiles and includes password protection and modification functions during startup. The temperature profiles are displayed directly on the touch screen.

3, Independent Heating Zones:
Includes three independently controlled temperature zones:

• Hot air heating for the upper and lower zones.
• IR heating for the bottom zone.
• The temperature is precisely controlled with an accuracy of ±2ºC. The upper heating zone can move freely as needed, while the second zone can be adjusted vertically. The top and bottom heaters allow multi-segment temperature control simultaneously. The IR heating zone's power output can be adjusted based on operational requirements.

Laptop Motherboard Repair

Suitable for repairing and replacing BGA chips on notebook motherboards.

Graphics Card Repair

Supports GPU rework and replacement for desktop and industrial graphics cards.

Game Console Repair

Used for Xbox, PlayStation, and other gaming console motherboard repair applications.

Industrial Control Boards

Ideal for repairing industrial automation control systems and embedded electronic boards.

Automotive Electronics Repair

Supports ECU, automotive control modules, and advanced electronic system maintenance.

Communication Equipment Maintenance

Applicable for repairing communication boards, networking equipment, and telecom devices.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

The DH-5830 BGA Rework Station can be used to repair:

• BGA solder joint cracks
• Cold solder joints
• GPU failure
• Chip replacement
• BGA reballing
• QFN component replacement
• CSP package repair
• PCB soldering defects

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Delivery detials of DH-5830 BGA REWORK STATION

Shipping:

1.Shipment will be done within 5 business days after receiving payment.

2.Fast delivery shipment by DHL,FedEX,TNT ,UPS and other ways including by sea or by air.