Infrared soldering station

                                                                                        Infrared soldering station

Full IR BGA rework station with 2 heating areas, being suited for a large size chip(less than 80*80 mm), 

and those PCB, such as, TV, Gaming console and computer etc.

Production parameter

Total Power	2300W
Top heater	450W
Bottom heater	1800W,fully enclosed in a glass-shielded compartment
Power	110~250V 50/60Hz
Top head movement	Up / down, rotate freely.
Lighting	Taiwan led working light, any angle adjusted.
Storage	Store 10 groups of temperature profile
Positioning	V-groove, PCB support can be adjusted in X, Y direction with external   universal fixture
Temperature   control	K Sensor, Closed loop
Temp accuracy	±2℃
PCB size	Max 270 * 320 mm Min 20* 20 mm
BGA chip	5*5~80*80 mm
Minimum chip spacing	0.15 mm
External temper sensor	1pc
Dimensions	L480×W370×H390 mm
Net weight	Approx 15.5KG

Product details

Top IR heater, 80*80 mm, used for almost all of chip to heat up

Be widely used for motherboards with big size up to 270*320 mm

Bottom IR fully enclosed in a glass-shielded

Instrument Panel for temperature and time setting, easy to operate and use conveniently

Instrument Panel

Infrared Soldering Station - Special Features:

• Imported heater: high quality and durable.
• Taiwan infrared preheating ceramic plate with glass guard.
• Two heating zones: the upper heater is infrared, and the lower heater is infrared preheating as well.
• K-type closed-loop control: temperature accuracy is within ±2°C. The external sensor connector detects the actual temperature during heating.
• Sound notification system: a voice reminder occurs 5–10 seconds before the completion of heating, alerting the operator to prepare.

Our Services

• Before Delivery: The machine will undergo vibration testing for at least 12 hours before delivery. Afterward, the machine will be tested again to ensure it is functioning properly.
• After Delivery: When the machine arrives at your location, we will contact you via email, phone, or WhatsApp to confirm that the goods have been processed in a timely manner.
• Machine Receipt: We will provide technical support for installation and operation.

FAQ

Q: How is the product packed?

A: The product is packed in a carton case with foam inside for protection.

Q: Are you a factory?

A: Yes, we are a factory with our own R&D department and a dust-free workshop.

Q: If I order a large quantity, can I get a better price?

A: Yes, please contact us for details.

Q: Can I visit your workshop?

A: Yes, you can visit. Please let us know in advance.

Infrared Soldering Station - Handling Electronic Assemblies

Electrostatic Discharge (ESD)

Certain components used in electronic assemblies are sensitive to static electricity and can be damaged by discharge. Static charges are created when non-conductive materials are separated, such as when plastic bags are picked up or opened, when friction occurs between synthetic clothing, or when plastic tapes are dispensed. These charges can also arise from many other sources.

Destructive static charges can accumulate on nearby conductors, such as human skin, and be discharged as sparks between conductors. For example, when the surface of a printed board assembly is touched by a person with a static charge, damage can occur if the discharge passes through a conductive pattern to a static-sensitive component. It's important to note that the level of static damage to components cannot usually be felt by humans (typically below 3,000 volts).

Electrical Overstress (EOS)

Electrical overstress (EOS) damage can be caused by unwanted energy spikes, which can occur within soldering irons, solder extractors, testing instruments, and other electrically operated equipment. This equipment must be designed to prevent electrical discharges that could cause harm.

ESD/EOS Safe Work Areas

The purpose of an ESD/EOS safe work area is to prevent damage to sensitive components from spikes and static discharges. These areas must be designed and maintained to minimize the risk of ESD/EOS damage.

Handling and Storage Methods

1,PC board assemblies must always be handled in properly designated work areas.

2,Designated work areas must be checked periodically to ensure they continue to meet safety standards for ESD protection. Key concerns include:

• A. Proper grounding methods.
• B. Static dissipation of work surfaces.
• C. Static dissipation of floor surfaces.
• D. Operation of ion blowers and ion air guns.

3,Designated work areas must be kept free of static-generating materials such as Styrofoam, vinyl, plastic, fabrics, or any other materials that generate static charges.

4,Work areas must be kept clean and neat. To prevent contamination of PC board assemblies, eating or smoking is not allowed in the work area.

5,When not in use, sensitive components and PC boards must be stored in shielded bags or boxes.

6,When handling PC board assemblies, the operator must be properly grounded by one of the following methods:

• A. Wearing a wrist strap connected to earth ground.
• B. Wearing two heel grounders and keeping both feet on a static dissipative floor surface.

7,PC board assemblies should be handled by the edges. Avoid touching the circuits or components (see Figure 1).

8,Components should also be handled by the edges whenever possible. Avoid touching the component leads (see Figure 2).

9,Hand creams and lotions containing silicone should not be used, as they can cause solderability and epoxy adhesion problems. Special lotions formulated to prevent contamination of PC boards are available.

10,Stacking PC boards and assemblies should be avoided to prevent physical damage. Special racks and trays are available for handling.