X-ray PCB inspection

X-ray detection principle
When X-rays(beams) penetrate the PCB, the differences in different materials to absorb the rays form a dark

or lighter image.
Dense solder joints or components will absorb more rays and form shadows on the detector. The internal

structure can be visually displayed through 2.5D/3D imaging technology.‌

The video of pcb X-ray inspection machine: 

Composition of the detection system

X-ray source: uses high-voltage diodes or radioactive isotopes to generate radiation, and adjusts the irradiation

angle through a collimator.

Detection system: Receive the intensity difference of penetrating rays and convert it into digital images for defect

analysis.‌

‌Image processing‌: Use enhancement, subtraction and other techniques to highlight defect features and support

automatic identification of parameters such as line width and solder joint shape.‌

Application 

Multilayer boards inspection: Penetrating the copper foil layer and resin to locate internal short circuits or open circuits.

Component inspection:
Identify hidden defects in BGA chips, IC packaging and other chip-levels.

Soldering quality control: Check the porosity of solder joints to ensure the reliability of SMT surface mounting.