Reballing BGA Chip Machine Color Vision

                                                   

Automatic Reballing BGA Chip Machine with Color Vision

An automatic reballing machine is a machine that automatically mounts a ball grid array (BGA) chip.

BGA chips are commonly used in electronic devices such as smartphones, laptops, and gaming consoles.

They contain hundreds or thousands of metal balls that connect the chip to the circuit board.

Model: DH-A2E

Product Features of Hot Air Automatic Reballing BGA Chip Machine with Color Vision

Color vision technology is often used in automatic reballing machines to ensure that the solder the BGA chip is placed correctly on

a motherboard. This technology uses various color sensors to detect the location and size of each solder ball and adjust its position

accordingly. This process ensures that the solder balls are precisely aligned with the connections on the circuit board, preventing

any electrical damage to the device.

•High successful rate of chip-level repairing. Desoldering, mounting, and the soldering process are automatic.

• Convenient alignment.

•Three independent temperature heatings + PID self-setting adjusted, temperature accuracy will be on ±1°C

•Built-in vacuum pump, pick up and place BGA chips.

•Automatic cooling functions.

2. Specification of Infrared Automated Reballing BGA Chip Machine with Color vision

Power	5300W
Top heater	Hot air 1200W
Bollom heater	Hot air 1200W, Infrared 2700W
Power supply	AC220V± 10% 50/60Hz
Dimension	L530*W670*H790 mm
Posilioning	V-groove PCB support, and with external universal fixture
Temperature control	K type thermocouple. closed loop control. independent heating
Temperalure accuracy	±2℃
PCB size	Max 450*490 mm, Min 22*22 mm
Workbench fine-tuning	±15mm forward/backward, ±15mm righ/left
BGAchip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(opional)
Net weight	70kg

3. Details of Laser positioning Automatic Reballing BGA Chip Machine with Color vision

4. Why Choose Our laser position Automatic Reballing BGA Chip Machine with Color vision?

5.Certificate of Optical alignment automatic Reballing BGA Chip Machine with Color vision

6. Packing list of Optics align Reballing BGA Chip Machine with Color vision

7. Shipment of Automatic Reballing BGA Chip Machine with Color vision

We ship the machine via DHL/TNT/UPS/FEDEX, which is fast and safe. If you prefer other terms of shipment,

please feel free to tell us.

How does it work? Video as below:

8. Contact us for an instant reply and the best price.

Email: john@dh-kc.com

MOB/WhatsApp/Wechat: +8615768114827

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9.Related news about Automatic Reballing BGA Chip Machine with Color vision

The Kechuang board will welcome the semiconductor company. Micro-semiconductor over 60% of the performance depends on major customers.

On the evening of March 29, the Shanghai Stock Exchange disclosed the list of the fourth batch of science and technology board declaration enterprises. Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "Zhongwei") was listed among them. This is the second semiconductor company that has been accepted by IPO after Jingchen Semiconductor became the first batch of enterprises in the company. Zhongwei was sponsored by Haitong Securities Co., Ltd., and the proposed financing amount exceeded 530 million.

According to the official website, China Micro founded in 2004, is a global micro-processing high-end equipment company, serving the semiconductor industry and other high-tech fields. The company's products provide etching equipment, MOCVD (metal-organic compound chemical vapor deposition) equipment, and other equipment for manufacturers of semiconductor products such as integrated circuits, LED chips, and MEMS.

According to its prospectus, from 2016 to 2018, the company's total assets were 1.1 billion yuan, 2.3 billion yuan, and 3.5 billion yuan respectively;operating income was 610 million yuan, 972 million yuan, 1.639 billion yuan respectively; attributable to the parent company The net profit of the owners was -2.39 billion, 30 million yuan and 0.9 billion yuan respectively. In the past three years, the company's accumulated R&D investment was 1.037 billion yuan, accounting for about 32% of operating income.

The first IPO-accepted semiconductor company Jingchen's prospectus shows that the sales of the top five customers in 2016, 2017 and 2018 were 831 million yuan, 1 billion yuan and 1.5 billion yuan respectively, accounting for the proportion of current operating income. The concentration is relatively high, 72.29%, 59.65%, and 63.35%.

Similar to Jingchen, Zhongwei also faces problems in terms of performance dependent on head customers. From 2016 to 2018, the proportion of the top five customers of Zhongwei accounted for 85.74%, 74.52% and 60.55% of the total operating income of the current period, respectively, the proportion decreased year by year, but the customer concentration is still high.

It is also worth noting that the global semiconductor equipment market is currently dominated by foreign manufacturers, and the industry presents a highly monopolistic competitive landscape. According to VLSI Research, sales of semiconductor equipment systems and services in the world in 2018 were 81.1 billion US dollars. Among them, the top five semiconductor equipment manufacturers occupied the world with their advantages in capital,technology, customer resources, and brand. The semiconductor device market has a 65% market share.

Among the top five companies, Asma has formed an oligopoly in lithography equipment. Applied Materials, Tokyo Electronics, and Fanlin Semiconductor are the top three processors for plasma etching and thin film deposition. Ketan Semiconductor is a leading company in testing equipment.

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