Microfocus high voltage xray source
Sep 12, 2025
Products Description
Advanced packaging not only requires high-density integration, high-speed transmission and low latency between chips,
but also ensures low energy consumption and reliability. These requirements make packaging technology face unpreced-
ented challenges.
However, during the packaging process, internal defects such as voids, cracks, offsets, etc. may occur due to various factors
such as materials and processes. These defects are difficult to detect through visual inspection, but will seriously affect the
performance and reliability of the package, leading to product performance degradation or even failure. Therefore, how to
ensure packaging quality has become the focus of the industry.
How to penetrate products with thicker materials and higher density?
Choosing a high-voltage Xray source can transfer more energy when the Xrays interact with materials, easily penetrate thicker materials or higher-density materials, easily obtain the internal structure of the device, and clearly present tiny defects.
In X-ray non-destructive testing, the voltage of the X-ray source is one of the important factors that determine its penetration capability. According to the principles of physics, the higher the voltage, the greater the energy the electrons gain in the electric field. High-voltage ray sources have higher energy output and can transfer more energy when interacting with matter, thus increasing the penetration ability and easily penetrating thicker materials or higher-density materials.
How to clearly see the packaging details in highly integrated products?
Penetration is only the first step. To protect the encapsulation, you still need to see the details clearly. The ray source is high-pressure and needs to have a tiny focus. The 130kV ray source adopts micro-focusing technology, which can produce a focus spot smaller than 8 microns in size, which can capture more subtle structures and defects and improve the resolution and clarity of imaging.
At this time, coupled with a high-definition FPD, it can help the device easily obtain more detailed internal structure information when penetrating high-density materials. Even for thick and dense materials, it can still image with high resolution, clearly showing the fine structure and tiny defects of the object.
Products summarization
The application of microfocus high-voltage x-ray source can not only discover internal defects and problems in the packaging process, providing a basis for subsequent repairs and improvements; it can also ensure the accuracy of solder joint quality, wire harness arrangement and packaging alignment, improve the performance and reliability of packaging, and provide strong support for the transformation, upgrading and high-quality development of the packaging industry.
