BGA Station Full Automatic Rework System
DH-A2E BGA Rework station. Full automatic Rework systems for SMD devices: BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and components of down to 1x1 mm. Contact us and get best price.
Description
BGA Station Full Automatic Rework System
A BGA Station Full Automatic Rework System is a type of electronics manufacturing equipment used for reworking
Ball Grid Array (BGA) components. It is a fully automated system that typically includes features such as automated
component removal, vision-based alignment, reflow heating, and cooling. The system is designed to streamline the
rework process, improve accuracy and consistency, and increase efficiency in electronics manufacturing.
Model:DH-A2E
1.Product Features of Hot Air BGA Station Full Automatic Rework System
- High successful rate of chip-level repairing. Desoldering, mounting and soldering process is automatic.
- Convenient alignment.
- Three independent temperature heatings + PID self-setting adjusted, temperature accuracy will be on ±1°C
- Built-in vacuum pump, pick up and place BGA chips.
- Automatic cooling functions.
2.Specification of Infrared BGA Station Full Automatic Rework System
| Power | 5300w |
| Top heater | Hot air 1200w |
| Bottom heater | Hot air 1200W. Infrared 2700w |
| Power supply | AC220V±10% 50/60Hz |
| Dimension | L530*W670*H790 mm |
| Positioning | V-groove PCB support, and with external universal fixture |
| Temperature control | Ktype thermocouple,closed loop control,independent heating |
| Temperature accuracy | ±2℃ |
| PCB size | Max 450*490 mm, Min 22 *22 mm |
| Workbench fine-tuning | ±15mm forward/backward,±15mm right/left |
| BGA chip | 80*80-1*1mm |
| Minimum chip spacing | 0.15mm |
| Temp Sensor | 1(optional) |
| Net weight | 70kg |
3.Details of Laser positioning BGA Station Full Automatic Rework System
4. Why Choose Our laser position BGA Station Full Automatic Rework System?
5.Certificate of Optical alignment BGA Station Full Automatic Rework System
6. Packing list of Optics align CCD Camera BGA Station Full Automatic Rework System
7. Shipment of BGA Station Full Automatic Rework System Split Vision
We ship the machine via DHL/TNT/UPS/FEDEX, which is fast and safe. If you prefer other terms of shipment,
please feel free to tell us.
8. Contact us for an instant reply and the best price.
Email: john@dinghua-bga.com
MOB/WhatsApp/Wechat: +8615768114827
Click the link to add my WhatsApp:
https://api.whatsapp.com/send?phone=8615768114827
9. Related News About the Automatic BGA Station Full Automatic Rework System Machine
Semiconductors and Electronic Equipment: Soft Board Manufacturers Increased Significantly Year-on-Year.
The value of FPC (Flexible Printed Circuit) and SLP (Substrate-Like PCB) has increased in the 5G era.
Apple's soft board manufacturers saw a 31% increase in March, while Taiwan's hardboard manufacturers experienced a 6% year-on-year increase.
Due to the low base in March 2023 and the impact of the Spring Festival holiday in February, Apple's soft board manufacturers' revenue increased by 31% in March. This was also supported by an adjustment in the operating rate, leading to a 61% revenue increase from the previous month. Among them, Harding's performance was particularly strong, with a 33% year-on-year revenue increase and a 59% quarter-on-quarter growth. On the hardboard side, due to relatively weak downstream demand, customers actively adjusted and lowered inventory levels. Taiwan's hardboard manufacturers saw a 6% increase in March, with a 21% rise compared to the same period last year.
FPC: Antenna Count, Transmission Lines, Penetration Rate, and ASP All Increased
In the 5G era, the antenna array has been upgraded from MIMO (Multiple Input Multiple Output) technology to Massive MIMO technology. This upgrade has significantly increased the number of antennas on each device, which in turn increases the number of RF (radio frequency) transmission lines. The high integration requirements of 5G have also driven FPC to replace traditional antenna and RF transmission lines. The penetration rate of FPC in Android devices is expected to rise significantly. Traditional PI (Polyimide) soft boards are no longer sufficient to meet the high-frequency, high-speed demands of the 5G era. FPCs made of MPI (Modified Polyimide) and LCP (Liquid Crystal Polymer) materials will gradually replace traditional PI. Compared with traditional PI, MPI and LCP have more complex manufacturing processes, lower yields, and fewer suppliers, but their ASP (Average Selling Price) is significantly higher.
PCB: The Available Area for PCBs in the 5G Era Is Shrinking, While SLP Penetration Rates Are Expected to Rise
Since 2017, motherboards have adopted dual SLPs (two layers of SLP and one HDI (High-Density Interconnector) board) to connect chips, reducing the volume to 70% of its original size. As the number of RF channels increases in the 5G era, the number of RF front-ends and the amount of data will rise, increasing the functionality and battery volume due to larger screens. This leads to tighter PCB space. The SLP penetration rate is expected to continue to rise and be adopted by the Android camp. The value of high-end single-chip SLPs using the M-SAP (Modified Semi-Automated Process) is more than double that of traditional Anylayer technology, bringing more value to mobile phone PCBs.
Investment Suggestion
We believe the PCB industry chain will fully benefit from the demand driven by 5G terminals. We recommend paying attention to PCB manufacturers and upstream material-related companies. Relevant companies in the industrial chain include FPC and SLP manufacturer Dongshan Precision (002384), Pending Holdings, Jingwang Electronics, Hongxin Electronics, and FPC electromagnetic shielding film manufacturer Lekai New Materials (300446).
Risk Factors
There is a risk of a sharp decline in smartphone sales; 5G commercial deployment may fall short of expectations; the industry could face a downturn; new product development may progress slower than expected; there is a risk of product price declines; new technology penetration may be slower than expected; and product market acceptance may be less than anticipated.
Related Products:
- Surface Mount Components Repair
- Hot Air Reflow Soldering Machine
- Motherboard Repairing Machine
- SMD Micro Components Solution
- LED SMT Rework Soldering Machine
- IC Replacement Machine
- BGA Chip Reballing Machine
- BGA Reball
- Soldering Desoldering Equipment
- IC Chip Removal Machine
- BGA Rework Machine
- Hot Air Solder Machine
- SMD Rework Station
- IC Remover Device
- Split-Color Optical Alignment System
