BGA Rework Station For Cellphone Repair

Dinghua DH-G730 Optical CCD Auto BGA Rework Station for Mobile Phone Motherboard Repair Chip Rework  

An Optical CCD Auto BGA Rework Station for Mobile Phone Motherboard Repair Chip Rework is a specialized 

piece of equipment used in the repair and rework of mobile phone motherboards. The station uses Optical CCD 

technology to align and rework small and delicate BGA (Ball Grid Array) chips and components.

Features Summary

☛ Widely used in Chip Level Repairing in mobile phone, small control boards or tiny motherboards etc.

☛ Rework BGA, CCGA, QFN, CSP, LGA, SMD, LED etc.

☛ Automatic desoldering, Mounting and Soldering, automatic pick upchip when desoldering completed.

☛ HD CCD Optical Alignment system for precisely mounting BGA and Components.

☛ BGA mounting accuracy within 0.01mm, Repair success rate 99.9%.

☛ Superior Safety Functions, with Emergency protection.

☛ User-friendly operation, Multi-functional ergonomic system.

The station is designed to automatically align the chip with the motherboard, apply heat to remove the old chip, 

and replace it with a new one. This process ensures that the chip is correctly aligned and secured, resulting in a 

fully functional motherboard.

The rework station is operated by trained technicians who have experience in mobile phone motherboard repair. 

It is essential to use the right tools and techniques to avoid damage to the motherboard and other components during repair.

The use of an Optical CCD Auto BGA Rework Station can significantly reduce the time and effort required to repair mobile

 phone motherboards. It ensures that the repair is accurate and efficient, resulting in a fully working device that meets the 

manufacturer's specifications.