Hot Air BGA Rework Station
1.Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed. 2.CE certification approved. Double protection (Overheating guard + emergency stop function.)
Description
Hot Air BGA Rework Station
1.Application of Hot Air BGA Rework Station
Motherboard of computer, smart phone, laptop, MacBook logic board,digital camera ,air conditioner, TV and other
electronic equipments from medical industry, communication industry, automobile industry, etc.
Suitable for different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.
2.Product Features of Hot Air BGA Rework Station
- Precise optical alignment system
- CCD camera amplify up to 200x, with top/down light brightness adjust function, mounting accuracy is within 0.01 mm.
- Automatic desoldering, Mounting and Soldering, automatic pick up chip when desoldering completed.
- Comes With 5 Different Size Of Nozzles: Upper 31*31mm, 38*38mm, 41*41mm. Bottom 34*34mm, 55*55mm
- High Power Cross Flow Fan, Cools The Pcb Very Quickly, Preventing It From Deformation.
3.Specification of Hot Air BGA Rework Station
| Power | 5300w |
| Top heater | Hot air 1200w |
| Bottom heater | Hot air 1200W. Infrared 2700w |
| Power supply | AC220V±10% 50/60Hz |
| Dimension | L530*W670*H790 mm |
| Positioning | V-groove PCB support, and with external universal fixture |
| Temperature control | Ktype thermocouple,closed loop control,independent heating |
| Temperature accuracy | ±2℃ |
| PCB size | Max 450*490 mm, Min 22 *22 mm |
| Workbench fine-tuning | ±15mm forward/backward,±15mm right/left |
| BGA chip | 80*80-1*1mm |
| Minimum chip spacing | 0.15mm |
| Temp Sensor | 1(optional) |
| Net weight | 70kg |
4.Details of Hot Air BGA Rework Station
5.Why Choose Our Hot Air BGA Rework Station?
6.Certificate of Hot Air BGA Rework Station
7.Packing & Shipment of Hot Air BGA Rework Station
8. Related Knowledge
What Are the Advantages of SMT Packages?
Surface Mount Technology (SMT) refers to the process of placing miniaturized or sheet-structured components suitable for surface assembly onto a printed circuit board (PCB) according to circuit requirements. These components are then assembled through soldering processes such as reflow soldering or wave soldering to form functional electronic assemblies.
The primary difference between SMT and Through-Hole Technology (THT) lies in the mounting method. On a traditional THT PCB, components and solder joints are located on opposite sides of the board. In contrast, on an SMT PCB, both solder joints and components are on the same side. Consequently, through holes on an SMT board are only used to connect circuit layers, resulting in significantly fewer and smaller holes. This allows for a much higher assembly density on the PCB.
SMT components differ from THT components primarily in their packaging. SMT packages are designed to endure high temperatures during soldering, requiring components and substrates to have a compatible coefficient of thermal expansion. These factors are crucial in product design.
Key Characteristics of SMT Process Technology
SMT differs fundamentally from THT in terms of assembly methods: SMT involves "sticking" components onto the board, while THT involves "plugging" components through holes. Differences are also evident in the substrate, component form, solder joint morphology, and assembly process methods.
Advantages of Selecting the Right SMT Package
- Efficient Use of PCB Space: SMT saves significant PCB area, allowing for higher density designs.
- Improved Electrical Performance: The shorter electrical paths enhance performance.
- Environmental Protection: The packaging protects components from external factors such as moisture.
- Reliable Connectivity: SMT ensures strong and stable communication links.
- Enhanced Heat Dissipation: Facilitates better heat management, testing, and signal transmission.
Importance of SMT Design and Component Selection
The selection and design of SMT components play a vital role in the overall product design. During the system architecture and detailed circuit design stages, designers determine the electrical performance and functions required of the components. In the SMT design phase, decisions about the package form and structure should align with equipment and process capabilities, as well as overall design requirements.
Dual Role of Surface Mount Solder Joints
Surface mount solder joints serve both as mechanical and electrical connections. The appropriate selection of solder joints directly impacts PCB design density, manufacturability, testability, and reliability.
