Manual BGA Rework Station

DH-5860 Manual BGA Rework Station

1.Application of DH-5860 Manual BGA Rework Station

Motherboard of computer, smart phone, laptop, MacBook logic board,digital camera ,air conditioner, TV and other electronic equipments from medical industry, communication industry, automobile industry, etc.

Suitable for different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chip.

2.Product Features of MCGS touch sceen Manual BGA Rework Station

• High success rate of repairing chips. 

(1)Precise temperature control.

(2)Target chip can be soldered or desoldered while no other components on PCB are damaged.No false welding or fake welding.

(3)Three independent heating areas increase temperature gradually.

(4)No damage to chip and PCB.

• Simple operation

Humanized design makes the machine easy to operate. Normally a worker can learn to use it in 10 minutes. No special professional experiences or skills is needed, which is time- and energy-saving for your company..

3.Specification of Hot air Manual BGA Rework Station

4.Details of DH-5860 Infrared Manual BGA Rework Station

5.Why Choose Our Manual BGA Rework Station?

6.Certificate of DH-5860 Manual BGA Rework Station

7.Packing & Shipment of DH-5860 Manual BGA Rework Station

8.Related knowledges of DH-5860 Manual BGA Rework Station

Summary of the top ten defects in PCB board design process

In today's industrially developed, PCB circuit boards are widely used in various electronic products. Depending on the industry, the color, shape, size, level, and materials of PCB boards are different. Therefore, it is necessary to have clear information on the design of the PCB board, otherwise it is prone to misunderstanding. This paper summarizes the top ten defects in the design process of PCB board.

First, the definition of processing level is not clear

The single-panel design is in the TOP layer. If you do not explain the positive and negative, you may make the board and install the device without soldering.

Second, the large area of copper foil is too close to the outer frame

A large area of copper foil should be at least 0.2mm or more from the outer frame, because it is easy to cause the copper foil to rise and cause the solder resist to fall off when milling the shape to the copper foil.

Third, draw pads with padding

Draw a pad with a pad to pass the DRC check when designing the line, but it is not suitable for processing. Therefore, the pad cannot directly generate solder resist data. When the solder resist is applied, the pad area will be covered by the solder resist, resulting in the device. Welding is difficult.

Fourth, the electric ground layer is the flower pad and the connection

Because the design is a flower pad mode power supply, the ground layer is opposite to the actual printed board image. All connections are isolated lines. Care should be taken when drawing several sets of power supplies or several ground isolation lines. The power supply is short-circuited and cannot cause the connection area to be blocked.

Five, the characters are placed

The character cover pad SMD soldering piece brings inconvenience to the printed board on-off test and component soldering. Character design is too small, making screen printing difficult, too large will make characters overlap each other, difficult to distinguish.

Six, surface mount device pads are too short

For the continuity test, for a too dense surface mount device, the spacing between the two legs is quite small, and the pads are also relatively thin. The test pins must be placed up and down, such as the pad design is too short, although not Affects device mounting, but causes the test pin to be misplaced.

Seven, single-sided pad aperture setting

Single-sided pads are generally not drilled. If the holes are to be marked, the aperture should be designed to be zero. If a numerical value is designed, when the drilling data is generated, the hole coordinates appear at this position, and a problem occurs. Single-sided pads such as drilled holes should be specially marked.

Eight, the overlap of the pads

In the drilling process, the drill bit is broken due to multiple drilling at one location, resulting in damage to the hole. The two holes in the multi-layer board overlap, and the negative film is formed as a spacer disk, which causes scrapping.

Nine, too many filling blocks in the design or filled blocks filled with very thin lines

There is a loss of the generated light data, and the light data is not complete. Because the filling block is drawn by lines one by one during the processing of the light drawing data, the amount of light drawing data is quite large, which increases the difficulty of data processing.

Ten, graphics layer abuse

Some useless connections were made on some graphics layers. The original four-layer board was designed with more than five layers, which caused misunderstanding. Violation of routine design. The graphics layer should be kept complete and clear during design.

The above is a summary of the top ten defects in the PCB board design process, according to we can improve the PCB board production progress, as much as possible to reduce the occurrence of errors.