Hot Air Solder Station

                     Automatic Hot Air Solder Station

Advantages of using an Automatic Hot Air Solder Station include the ability to precisely control the temperature, 

making it possible to work with a wide range of components, including delicate or heat-sensitive ones. Additionally, 

the automatic control makes the soldering process more efficient, as the temperature and airflow are automatically 

adjusted based on the task at hand.

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1.Application Of laser positioning Hot Air Solder Station

Work with all kinds of motherboards or PCBA.

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, 

PBGA,CPGA,LED chip.

DH-G620 is totally same as DH-A2, automatically desoldering, pick-up, puting back and soldering for a chip, with optical alignment for mounting,no matter whether you have experience or not, you can master it in one hour.

2.Specification of DH-A2 Hot Air Solder Station

power	5300W
Top heater	Hot air 1200W
Bottom heater	Hot air 1200W.Infrared 2700W
Power supply	AC220V±10% 50/60Hz
Dimension	L530*W670*H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	K type thermocouple, closed loop control, independent heating
Temperature accuracy	±2℃
PCB size	Max 450*490 mm,Min 22*22 mm
Workbench fine-tuning	±15mm forward/backward,±15mm right/left
BGAchip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(optional)
Net weight	70kg

3.Details of Infrared Hot Air Solder Station

4.Why Choose Our Hot Air Solder Station Split Vision? 

5.Certificate of CCD Camera Hot Air Solder Station

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, 

Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

6.Shipment for Hot Air Solder Station with Optical alignment

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.

7. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

8. Related knowledge

Wiring is an essential part of the PCB design process.

1,Wiring Precautions Between Power and Ground

(1) Add a decoupling capacitor between the power supply and ground. Be sure to connect the power supply to the pin of the chip after the decoupling capacitor. The following figure shows several incorrect connection methods and one correct connection method. Do you make such mistakes against the reference? Decoupling capacitors generally serve two functions: one is to provide the chip with a large current, and the other is to eliminate power supply noise. This minimizes the noise of the power supply and prevents noise generated by the chip from affecting the power supply.

(2) Try to widen the power and ground wires. It is better for the ground wire to be thicker than the power wire. The relationship is: ground wire > power wire > signal wire.

(3) A large copper area can be used as a ground wire; the unused areas on the printed board can be connected to the ground for use as a ground wire. In a multi-layer board, the power supply and ground line can each occupy one layer.

2,Processing When Mixing Digital Circuits and Analog Circuits

Nowadays, many PCBs are not single-function circuits but are composed of a mixture of digital and analog circuits. Therefore, it is necessary to consider the interference between them when wiring, especially the noise interference on the ground.

Due to the high frequency of digital circuits, analog circuits are particularly sensitive. For the signal line, the high-frequency signal line should be as far away as possible from the sensitive analog circuit devices. However, for the entire PCB, the ground line is connected to the outside node, and there can only be one. Thus, it is necessary to address the issue of the common ground between digital and analog circuits on the PCB. In the circuit board, the ground of the digital circuit and the ground of the analog circuit are effectively separated, but the PCB connects to the outside world through interfaces (such as plugs). The ground of the digital circuit is short-circuited with the analog circuit. Please note that there is only one connection point, and there is no common ground on the PCB, as determined by the system design.

3,Treatment of Line Corners

There will usually be a change in the thickness of the corners of the line, and some reflection may occur when the thickness changes. The corner method is most detrimental to the thickness of the line. A right angle is the worst, a 45-degree angle is better, and a rounded corner is the best. However, rounding corners can be more troublesome for PCB design, so it is generally determined by the sensitivity of the signal. Standard signals can use a 45-degree angle, while only very sensitive lines need to be rounded.

4,Check the Design Rules After Laying Out the Lines

Regardless of the task, it is important to check your work after completion. Just as we check our answers when we have time, this is an important way for us to achieve high scores. The same applies when drawing PCB boards; this ensures we can be confident that the circuit board we design is a qualified product. We generally check the following aspects:

(1) The distances between lines, lines and component pads, wires and through holes, and component pads and through holes-whether these distances are reasonable and if production requirements are met.

(2) Is the width of the power and ground wires appropriate? Is there tight coupling between the power supply and ground (low wave impedance)? Is there an area on the PCB where the ground wire can be widened?

(3) Are the best measures taken for key signal lines, such as the shortest length, added protection lines, and clear separation between input and output lines?

(4) Do the analog circuit and digital circuit sections have separate ground lines?

(5) Will any patterns (such as illustrations and labeling) added to the PCB cause a signal short circuit?

(6) Modify any unsatisfactory line shapes.

(7) Are there process lines on the PCB? Does the solder mask meet production process requirements? Is the solder mask size appropriate, and is the character mark pressed on the device pad to avoid affecting the quality of the electrical equipment?

(8) Has the edge of the outer frame of the power supply layer in the multilayer board been reduced? For example, the copper foil of the power supply ground layer is likely to cause a short circuit if it is exposed outside the plate.