
Smart Soldering Rework Station DH-A2E
It is an intelligent soldering and rework station with a built-in microcontroller for precise temperature control and a digital display.
Description
DH-A2E Global Hot-selling Intelligent Optical Alignment BGA Rework Station
Work Video:
- The station has a compact design with a sleek LCD screen and a user-friendly interface for easy operation.
- It comes with a range of interchangeable nozzles for various soldering and rework applications.
- The station uses a high-performance heater and temperature sensor for fast heat-up and temperature recovery time.
- It has a wide temperature range from 50°C to 350°C for versatile use.
- The station also features an auto-sleep function to conserve energy and prolong the lifespan of the heating element.
- It comes with a durable metal stand for holding the soldering iron and nozzles when not in use.
- The Smart Soldering Rework Station DH-A2E is suitable for both professional and DIY projects, including electronics repair,
circuit board soldering, and component replacement.


Applications
Complete range of rework applications in small, medium, and large scale service centers and manufacturers.
Chip level repair on motherboards for mobile phones, radios, PDAs, handhelds, laptops, notebooks, network nodes ,
communication equipment etc. , such as all devices, systems, programs, connectors, etc.
Apply to all chips, including: BGA、PBGA、CSP、QFN、PGA,POP, PLCC,CCGA,CBGA, QFN,VQFN,VGA,BQFC,TDFN,
TQFP, TSOP, CPGA, etc.

The Smart Soldering Rework Station is a tool used for soldering and desoldering electronic components.
Its main functions include:
Temperature control: The station has a digital temperature display and control system that allows the user to set
and adjust the temperature according to the requirements of the project.
2. Soldering iron: The soldering iron is the main tool used for soldering components. The Smart Soldering Rework Station
has a high-quality soldering iron that heats up quickly and maintains a stable temperature during use.
3. Desoldering gun: The desoldering gun is used to remove components from a circuit board. The Smart Soldering Rework
Station has a desoldering gun that uses a vacuum pump to remove solder from the component.
4. Hot air gun: The hot air gun is used to remove components that cannot be desoldered with a desoldering gun. The Smart
Soldering Rework Station has a hot air gun that can be used for a variety of tasks, including reflow soldering and plastic welding.
5. Precise control: The station provides precise temperature control and soldering/desoldering settings for accurate, high-quality
results.
6. Safety features: The Smart Soldering Rework Station has safety features such as automatic shut-off and over-temperature protection
to prevent damage to the components being worked on and to the station itself.







Packaging
Materials: Strong wooden case+wooden bars+proof pearl cottons with film
Dimension:81*76*85CM
Gross weight: 115 kg
Packing List(Except )
1pc BGA Rework Machine
1pc brush pen
1pc Instruction Manual
1pc CD video
3pcs top nozzles
2pcs bottom nozzles
6pcs universal fixtures
6pcs fastened screws
4pcs support screw
1pc tweezer
Sucker size: Diameters in 2,4,8,10,11mm
Inner hexagon spanner: M2/3/4

Services
1. At pre-sales, free for demonstration and information consults, on-site or by video.
2.Can provide process video or training before shipment, at your need.
3. At after-sales, with a strong professional technical back-up team.
4. Offer a huge discounts for massive order volume or for repeated orders.
5.Warranty: 1 year for free, and to receive parts cost for further years.
FAQ
1. How about the package? Is it safe during the delivery?
All mobile phone LCD refurbished machines are packed Safely, by standard strong wooden carton or carton box with foam inside.
2. What is the delivery way? How many days will the machine come to us?
We will ship the machine by DHL, FedEx, UPS, etc (Door to Door Service), around 5 days to arrive.
Or by Air to your airport (Door to Airport Service ), around 3 days to arrive.
Or by Sea to the seaport, Minimum CBM requirement: 1 CBM, around 30 days to arrive.
3. Do you provide the Warranty? How about the after-sales service?
1-year warranty free for spare parts, Whole life technical support.
We have a professional after-sales team, if any questions, assistant videos are also provided in after-sale service.
4. This machine is easy to operate? if I have no experience, Can I also operate it well?
Do you provide the user manual and operating videos to support us?
Yes, our machines are designed to use easily, Normally it will take you 2-3 hours to learn how to operate, if you are a technician,
it will be much faster to learn. We will provide the English user manual for free, and the operation video is available.
5, If we come to your factory, you will provide free training?
Yes, warmly welcome to visit our factory, we will arrange the free training for you.
6. What is the payment way?
We accept payment terms: Bank transfer, Western Union, Money Gram, Paypal, etc.
Specification:
Total Power | 4900W |
Top heater | 1200W |
Bottom heater | 2nd 1200W, 3rd IR heater 2700W |
Voltage | AC220V/110V±10% 50Hz |
Feeding system | Auto feeding system for chip |
Operation mode | Two modes: manual and automatic, free choose! HD touch screen, intelligent human-machine, digital system setting. |
Temperature profile storage | 50,000 groups(un-limited number of groups) |
Optical CCD camera lens | Automatic stretching out and folding to pick and place BGA chip |
Camera magnification | 1.8 million pixels |
Workbench fine-tuning: | ±15mm forward/backward, ±15mm right/left |
Placement accuracy: | ±0.015mm |
Bga positioning | Laser positioning, fast and accurate position of PCB and BGA |
PCB position | Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures. |
Lighting | Taiwan led working light, any angle adjustable |
Temperature control | K sensor, close loop, PLC control |
Temp accuracy | ±2℃ |
PCB size | Max 450×400 mm Min 22×22 mm |
BGA chip | 1x1 - 80x80 mm |
Minimum chip spacing | 0.015mm |
External temper sensor | 1pc |
Dimensions | L740×W630×H710 mm |
Net weight | 70KG |







