X Ray Inspection Pcb

X-ray inspection PCB is an effective inspection method that can detect various defects in PCB. It uses the penetration of

X-rays and the difference in absorption capabilities of different materials to detect defects and anomalies inside the PCB.

X-ray inspection can detect PCB pad defects, welding defects, alignment problems, internal structure problems, etc.

In addition, X-ray inspection can also detect defects such as bubbles, impurities and cracks in PCBs.

Through X-ray inspection, the reliability and stability of products can be effectively improved, and production pauses and

after-sales maintenance problems caused by PCB defects can be avoided. At the same time, X-ray inspection can also improve

production efficiency and reduce production costs.

X-ray machine for PCB has the following features:

1. High precision and high resolution: It can clearly display every detail on the motherboard, including solder joints,

connectors, chips, and circuits, so that defects and anomalies can be accurately detected.

2. Non-destructive testing: X-ray testing does not cause any damage to the motherboard, so it can be used to detect

various types of materials and components, including plastics, metals, ceramics, etc.

3. Automation and intelligence: Modern X-ray inspection equipment usually has the function of automatically identifying

and classifying defects, and can quickly and accurately detect various defects and anomalies on the motherboard.

4. Multi-angle and all-round inspection: X-ray inspection equipment usually has rotation and tilt functions, which can

Inspect the motherboard from multiple angles to ensure comprehensive coverage of all areas.

5. Reliability and stability: X-ray inspection is a reliable inspection method that can achieve stable quality control during

the production process.

In short, the X-ray machine for motherboards is a high-precision, high-resolution, non-destructive, automated, and

intelligent testing equipment that can quickly and accurately detect various defects and anomalies on the motherboard,

thereby improving product reliability and stability, reducing production costs and risks.

 

Electronics X-ray inspection

Max tube voltage	90KV
Max tube current	200μA
Warm	Automatically start after unlock
Focal spot size	5μm
Xray light source	Hamamatsu(imported from Japan)
Flat Panel detector	New type TFT
Inspection mode	offline
Light tube type	sealed type
Geometry magnification	200 times
Display screen	24 inches
Operating system	Windows10 64
CPU	i5 +8400
Hard disk/memory	1TB/8G
Radiation dose	less 0.17mSv
Effective area	130mm*130mm
Resolution	1536*1536
Spatial resolution	14lp/mm
local spot size	5um
Dimension	1500 ×1500 ×2100mm
Weight	1500KG

 

The principle of BGA X-ray inspection is to use the penetrative ability of X-rays and the differences in absorption capacity

between different materials to detect defects and abnormalities inside BGA solder joints. X-ray inspection can identify issues

such as voids, bubbles, and uneven solder joints, as well as performance indicators like solder joint strength and electrical connectivity.

In X-ray inspection, the absorption rate or transmittance of X-rays through BGA solder joints depends on the composition and

thickness of the materials. As X-rays pass through the solder joints, they strike the phosphor coating on the X-ray-sensitive plate,

exciting photons. These photons are then detected by the flat-panel detector, and the signal is processed, amplified, and further

analyzed by a computer before being presented on the screen. Different BGA solder joint materials absorb X-rays to different

degrees, resulting in varying levels of transparency. The processed grayscale image reveals differences in density or material

thickness of the inspected object.

Based on these differences, X-ray inspection equipment can accurately identify and classify various defects and anomalies in

BGA solder joints. Moreover, modern X-ray systems feature automatic defect identification and classification, enabling fast and

precise detection of various faults and irregularities.

In summary, the principle of BGA X-ray inspection is to detect internal defects and abnormalities in solder joints by leveraging

the penetrability of X-rays and the differing absorption rates of materials. This improves product reliability and stability while

reducing production costs and risks.

With the increasing demand for electronic devices, the need for quality control has become paramount. X-ray inspection is

an essential tool in ensuring that the electronic components are manufactured to the highest standard. This not only helps

to prevent defects but also ensures that the final product is of the highest quality, thus increasing customer satisfaction.

Moreover, electronic x-ray inspection has significantly reduced the likelihood of product recalls and returns, as potential

defects are identified and corrected before the products are released. This has saved companies a significant amount of money,

time, and resources that would have been lost in the event of a recall.

     

                  Aluminim part                                                             Forging part                                                  BGA chip

 

It should be noted that X-ray inspection is not omnipotent and cannot detect all types of defects. Therefore, when using

X-ray to detect PCBs, it is necessary to select appropriate detection methods and equipment according to the specific

situation, and conduct a comprehensive evaluation in conjunction with other detection methods to ensure the quality and

reliability of the product.

 

How to operate xray inspection PCB: