Microfocous Xray Source
With 40°radiation angle and 90KV, inspected for voids, shorts and soldering bridge.
Description
Product Description
DH-KV9040 is a micro-focus X-ray source integrated in a single unit, independently developed and designed by Dinghua. With a maximum voltage of 90kV and an image resolution of 5–10μm, it is primarily used for electronic industry inspection, such as 4-plane packaging, 3C battery testing, BGA packaging, LED, and PCB inspection.
Product Feature
* Integrated design for easy disassembly and installation
* 5–10μm image resolution and 9.5mm FOD, suitable for high-resolution, high-magnification imaging systems
* Supports offline/online operation, ideal for stable long-term exposure
* Industry-standard RS-232C communication protocol for easy integration
Product Parameter
|
X-ray Tube Voltage Adjustable Range (kV) |
0~90 |
|
X-ray Tube Current Adjustable Range (μA) |
0~200 |
|
Maximum Tube Power (W) |
8 |
|
Image Resolution* (μm) |
5/10 |
|
X-ray Radiation Angle |
40° |
|
Minimum Focal/Objective Distance (FOD) (mm) |
9.5 |
|
Weight (kg) |
≈10 |
|
Data Transmission |
RS-232C |
|
Input Voltage (V) |
24 |
|
Power Consumption (W) |
＜96W |
|
Operating Temperature (℃) |
10~40 |
|
Storage Temperature (℃) |
0~50 |
|
Operating Humidity (%RH) |
20~85 |
|
Storage humidity (%RH) |
20~85 |
|
EMC compliance |
IEC/EN 61326-1 |
|
Applicable operating system version |
Windows 7, 10 & 11 |
Products illustration
Our microfocus X-ray source is specially designed for high-precision inspection of electronic components and assemblies.
With a maximum tube voltage of 90kV and tube current up to 200µA, it delivers clear, high-resolution imaging for detecting internal defects in circuit boards, semiconductors, and other dense materials. The system operates on a 24V input voltage,ensuring stable and efficient performance in industrial environments.
Optimized for microfocus applications, this X-ray source provides sharp images with minimal distortion, making it particularly suitable for solder joint inspection, internal crack detection, and identification of hidden structural defects. Its compact design allows easy integration into PCB inspection systems while maintaining stable output. The combination of 90kV penetration power and fine microfocus spot size effectively shortens inspection time.
Our microfocus X-ray source (operating voltage 40–90kV) is a versatile tool designed for high-precision inspection of electronic components and metal parts. It is widely applied in PCB and motherboard analysis, as well as in die-casting inspection for mobile phone, automotive, and aerospace industries. Shown on the right is an example of die-cast parts from a well-known cellphone manufacturer. With this system, defects such as cracks, pores, shrinkage cavities, uneven material distribution, and internal structural flaws can be clearly identified.
The source delivers a maximum tube current of 200µA, supported by a stable 24V input voltage, ensuring reliable operation even in demanding environments. Its microfocus design produces sharp, distortion-free images, enabling engineers to precisely analyze subtle structural differences. For electronic applications, it is particularly effective in solder joint inspection, BGA chip analysis, and semiconductor packaging. For metal parts, its strong penetration enables deep observation without compromising image clarity.
With its compact design, the 40–90kV X-ray source is easy to integrate into inspection systems, providing manufacturers with a powerful solution for quality control, R&D, and failure analysis. By combining fine focus detail with strong penetration, it enhances inspection reliability while significantly reducing inspection time.
