How to use BGA rework station

The correct operation of Dinghua BGA rework station requires strict procedures to ensure accurate temperature

control and accurate positioning to avoid damage to the motherboard or chip. Here are the key steps and precautions:

The first step:
‌Positioning and fixing‌
Put the motherboard on the work platform, use laser positioning or optical alignment system to ensure that the center

of the chip is coaxial with the air nozzle, and use universal fixtures to fix the PCB to prevent displacement. ‌

The second step:

Set profiles

To set profiles for desoldering or soldering, even alignment position, you can set 5 to 8 segments for Dinghua BGA rework

station, such as, Automatic bga rework machine DH-A2E and DH-A5, if you'd like to see how to set, please add me on your

WhatsApp/Wechat:+8615768114827, i can show you.

How to set profiles on the BGA rework station DH-A5: 

‌The Third step:

Heat up and Warm-up phase‌
Start the Upper hot-air, low hot-air and bottom infrared heater to evenly heat the chip  80~250°C (IR 150-200 for PCB board)

(automatically finish four stages: preheating, heating, reflow, and cooling) to release the stress within the board. ‌

PS： if you just soldered a chip, the whole process is finished. 

        if you just desoldered a chip, you need to continue as below.

The forth step:

Cleaning and planting‌
Use soldering wick to clean the residual tin on the pad an chip. If the chip needs to be replaced, re-apply flux and reballing;

the renewed chip needs to be accurately aligned and mounted. ‌

The fifth step:

Soldering and Cooling‌
Repeatedly heat up the temperature to the soldering temperature curve to fuse the solder ball and the pad and then naturally

cool to room temperature.

Preventive measures
Temperature control: Excessive temperature may damage components, while insufficient temperature can result in poor

soldering.
It is recommended to follow the equipment's recommended curve or the manufacturer's suggested parameters. ‌‌

Alignment accuracy: Manual machines require a precision of ±0.01mm, while automatic machines achieve higher alignment

accuracy through an optical.

Imaging system. ‌‌

Environmental Requirements: The operating area must be free of static electricity, dust-free, and maintain stable temperature,
while avoiding excessive humidity or static interference. ‌‌

**Tool Preparation**: Use specialized desoldering tape, microscopes, flux paste, soldering wick, brush and other tools
to assist in cleaning and inspecting solder joint quality(if you have enought budgt, you can consider an xray inspection machine. for instance,

Dinghua DH-X8 pcb xray inspect machine)