Rework Station Reballing
This machine is for repairing motherboard IC/Chip/Chipset of Laptop, Mobile, PC, iPhone, Xbox, etc. With features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Cooling Fan, Micro hot-air adjustment, Vacuum Pick-up & Place, Universal Support for most of the PCB Size/Shape.
Description
DH-5830: Your Intelligent Partner in Precision BGA Repair
Searching for a professional Bga chip replacement machine that offers intelligent control and exceptional value? Look no further. The Dinghua DH-5830 3-Zone BGA Rework Station is engineered to be the ultimate bga ic reballing machine for your workshop. Combining a user-friendly touchscreen interface with a powerful triple-zone independent heating system, it transforms complex bga soldering machine tasks into simple, reliable procedures. Whether you are handling motherboard or graphics card repairs, this versatile tool delivers consistent precision for efficient component replacement and reballing.
Products Parameters
| Total Power | 5500W |
| Top heater Power | 1200W (1st Hot air heater) |
| Bottom Heater | 1200W(2nd hot air heater), 3000W (IR preheat) |
| Temperature Accuracy | ±2℃ |
| Power Supply | AC220V±10％ 50Hz |
| Dimension | 700x760x580mm (L*W*H) |
| Temperature Profile Storage | 50,000 groups |
| Operation Mode | Manual+Touchscreen |
| PCB Support | V-groove + universal fixture + 5-points support + Adjustable in X direction |
| Temperature Control | K-type Thermocouple + Closed Loop |
| PCB Size | Max.410x370mm, Min. 22x22mm |
| BGA Chip | 2x2mm-80x80mm |
| Minimum Chip Spacing | 0.15mm |
| External connector for temperature testing | 1pcs or Customized |
| Net Weight | 35KG |
| Features | bga soldering machine, bga chip replacement machine, bga ic reballing machine |
Products Application
Motherboard of computer,smartphone,laptop,digital camera ,air conditioner,TV and other electronic equipments from medical industry,communication industry,automobile industry,etc.
Wide range of application: BGA, PGA, POP,BQFP, QFN, SOT- 223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, LED chip.
Core Features
Triple-Zone Intelligent Heating: An expert-level bga soldering machine featuring three independent heating zones (top + dual bottom). This design ensures even heat distribution across complex PCBs, crucial for successful bga ic reballing machine operations and protecting sensitive components.
Pro-Grade Process Control: Built-in PLC and a high-definition touchscreen offer intuitive control. Store countless temperature profiles, perform real-time curve analysis, and manage every parameter for perfect results as a reliable bga chip replacement machine.
Versatile & Protective Design: The movable universal fixture accommodates PCBs up to 500x400mm (Max) and protects board edges. It's compatible with BGA chips from 2x2mm to 80x80mm, making it an adaptable tool for various repair scenarios beyond a standard bga soldering machine.
User-Centric & Safe Operation: Features like external temperature sensor ports, a vacuum pickup pen, voice prompts for step completion, and an emergency stop button are designed for precision and safety, which is vital for any professional-grade bga ic reballing machine.
Products Details
1. Nozzle with Reflow Vent
1) All the Nozzles are made by Titanium Alloy.
2) Top Nozzle has Reflow Vent to prevent the damage to surrounding components.
3) Magnetic Nozzle, Easy to install / adjust / change.(bga ic reballing machine)
2. LED Light
A high Power LED light with flexible tube will give you a bright rework, you can effectively see the melting of tin or mold on small components.
3. Cooling Fan
1) Cross air flow to cool the PCB after heating, it is important for prevent deformation
2) Auto Cooling after the heating complete.
4. Top Air Flow Adjust Button
With top air speed adjustable function, prevent small bga chip from moving flow by strong air.
The bga chip replacement machine represents an essential toolset for electronics technicians performing precision ball grid array component repairs and rework. Designed for workshops, manufacturing facilities, and repair centers handling small to medium volume BGA operations, this comprehensive station combines professional-grade thermal control tools with specialized accessories to deliver reliable results without the complexity of fully automated systems. Its balanced design offers the perfect compromise between operator control and process repeatability, making it particularly valuable for mixed-component environments where flexibility matters as much as precision.
Central to the station's capability is its dual-zone thermal management system featuring a high-precision hot air rework tool with digital temperature control. The handheld rework nozzle provides adjustable airflow from 20 to 120 liters per minute across a temperature range of 100°C to 500°C, with ceramic heating elements ensuring rapid thermal response and excellent stability. A separate bottom preheater plate offers 200x200mm heating area with uniform temperature distribution, gradually warming the PCB substrate to prevent warping during component removal. The analog controls allow experienced technicians to make real-time adjustments based on visual cues and thermal indicators, while built-in timers help maintain consistent process durations.
Component manipulation tools demonstrate thoughtful engineering tailored for manual operation. The station includes a selection of vacuum pickup pens with interchangeable tips sized for various BGA packages, featuring adjustable suction strength and ergonomic grips for precise control during component placement. A set of high-quality stainless steel tweezers and spatulas with anti-static coatings enable safe handling of delicate components, while the included flux applicators ensure proper chemical preparation of contact pads. The work area features a magnifying lens with integrated LED lighting, providing 3X to 5X magnification for visual inspection of solder ball conditions and pad alignment.
Who Is This For?
The DH-5830 is the ideal choice for electronics repair shops, IT service centers, and technical training institutes that require a professional-grade bga chip replacement machine. Its balance of intelligent automation, precision heating for delicate bga ic reballing machine tasks, and robust construction makes it a cost-effective core tool for any serious technician focused on component-level repair.
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