Optical BGA Rework System

  An optical BGA rework system DH-A2E is a cutting-edge repair system for precise removal, alignment, and soldering of Ball Grid Array (BGA) components that are attached to printed circuit boards (PCBs). It is distinct from manual systems in that it has a high-definition optical alignment system (typically by means of a split-vision camera or CCD imaging) that superimposes the image of the chip's solder balls onto the PCB pads in real time.

  This technology ensures alignment accuracy, making it ideal for high-density components found in mobile phones, laptops, Xbox playstation, networking devices, and other complex electronics.

 Optical BGA rework system DH-A2E will typically involve the use of infrared or hot-air heating, multiple independent heating zones, automatic pick-and-place with vacuum system, and real-time temperature profile control. It therefore enables high efficiency, repeat capability, and less possibility of defects during soldering as is the case with manual methods.

Smart PC (Brains of machine)

1.PLC system, human-machine interface with touch screen for easy operation and high accuracy rework

2.Manage the temperature profile: setting, storage, application, analysis, debug. Up to 16-segments temperature control, 100000 groups storage for different BGA's rework temperature profile.

3.Control the machine.

Optical Alignment

Name: CCD Camera LensBrand: Panassonic
Origin: Japan

1.Effectively increase the accuracy of alignment and success rate of repairing.

2.Image displayed on monitor screen

Manual & Automatic Mode

1.Manual: Joystic ( A. to right/left-camera images zoom in/out. B. up/down-top heater up/down )

2.Just press one botton to start
soldering/desoldering/mouting process.

Built-in infrared laser positioning , help fast positioning for PCB board.

Vaccum Suction Nozzle

1.Mounting head with built-in pressure testing device, to protect the PCB from being crused.

2.Build-in vacuum in mounting bead
pick up BGA chip automatically after desoldering completed. 

Three Independent Heater ( 3 Temp Zones)

1.Top hot air + Bottom hot air + Infrared preheating platform. The top and bottoom can be moved upward/downward.

2.Make heating focused and even. Effectively increase rework rate. 

1.Optical alignment which makes a chip accurately aligned,exactly avoid misplacement even shifting;

2.Automatically remove, pick up and solder,etc. Which can be exactly instead of a veteran;

3.No damage to devices during desoldering and soldering (including damage of appearance and function);

4.The desoldering and soldering process does not affect the periphery and back of the chip;

5.For the preheating temperature, the luminous heating tube is used. The temperature increased is fast and the constant temperature is stable, and the PCBA desoldered and soldered does not change color or deform;

6.External temperature measurement interface, convenient to detect the temperature at any time, the temperature control is more accurate and reliable;

7.Touch screen operation, the program is preset in advance, without professional technical training can be skilled in use, so that the chip disassembled and welded becomes very simple;

8.Manual and automatic operation of the two modes, debugging or batch-repair are more convenient and simple;

9.External usb interface for software updates and import of various repair data into computer analysis and storage;

10.Disassembling and welding of lead-free or lead products are applicable;

11.Suitable for multiple patch device repair (POP, SOP, SOJ, QFQ, QFN, BGA, PLCC, SCP ... );

 

 

 

 

 

 

SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO., LTD is a leading manufacturer specializing in soldering equipment.