Cell Phone Motherboard Repair Machine
Automatic BGA Rework Station for laboratory, with automatically receiving chip after desoldering.With optical CCD lignment system for mounting, automatically removing, picking up, replacing and soldering. Keywords：bga balling machine，motherboard chipset repair machine，laptop motherboard repairing
Description
Fully Automatic Optical Alignment BGA Rework Station DH-A2E - The Ultimate Motherboard Chipset Repair Machine
Products Parameters
The DH-A2E redefines precision in automated BGA reballing machine operations. Designed for high-volume production, this advanced motherboard chipset repair machine sets a new standard with its fully automatic optical alignment system, ensuring perfect placement for complex laptop motherboard repairing and other critical PCB rework tasks.
| Rated power | 4900W |
| Upper power | 1200W |
| Bottom power | 2nd :1200W; 3rd:2400W |
| Temperature accuracy | ±2 ℃ |
| External tempertures' ports | 1 pcs (optional) |
| Alignment accuracy | 0.01mm |
| Motherboard size | Max400*450mm Min 10*10mm |
| Chip spacing | 0.1mm |
| Chip-feeding | Automatic picking up and replacing |
| Mounting | Automatically mounting |
| Optical CCD | Automatically going out and back, and focus. |
| Dimension | L600mm*W700mm*H850mm |
| Net weight | 70kg |
| Application | bga balling machine,motherboard chipset repair machine,laptop motherboard repairing |
Products Application
This bga balling machine can repaor motherboard of computer,smartphone,laptop,digital camera ,air conditioner,TV and other electronic equipments from medical industry,communication industry,automobile industry,etc.
Wide range of application: BGA, PGA, POP,BQFP, QFN, SOT- 223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, LED chip.
Details Pictures
Key Features
1.Industry-Leading Automation: As a top-tier BGA reballing machine, it performs automatic chip disassembly, soldering, and retrieval with zero human error, maximizing throughput for laptop motherboard repairing lines.
2.Optical Precision Alignment: Its digital vision system guarantees perfect placement every time. This is crucial for a reliable motherboard chipset repair machine, as it completely eliminates misalignment during delicate operations.
3.Professional-Grade Temperature Control: Features three-zone heating with ±1℃ accuracy, providing the uniform heat profile essential for consistent results in any professional BGA reballing machine used for laptop motherboard repairing.
4.Versatile for Demanding Repairs: Handles chips from 2x2mm to 80x80mm, making it the ideal motherboard chipset repair machine for a wide range of components, from small chipsets to large GPUs.
5.User-Friendly Professional Operation: The HD touchscreen and pre-set programs simplify complex processes, allowing technicians to master this advanced BGA reballing machine quickly for efficient laptop motherboard repairing.
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