BGA Soldering Machine
Upgraded from DH-5860, with upper hot-air adjustable function, but steel-mesh for the IR perheating area protection, safer and higher efficiency for various chips/motherboards, such as,ASIC hash board, Macbook,computer and game console ,etc. repairing.
Description
DH-5880 BGA soldering machine with PID for temperatures compensation
New designed BGA rework machine with steel-mesh for IR preheating area protecting, which can repair almost chips, such as,
BGA, QFN，LGA, DMA,POP etc. of computer, macbook, laptop, desktop, hasb board, game console and other motherboards and so on.
Ⅰ. Parameter of BGA soldering machine for hash board repairing
| Power supply | 110~240V +/- 10% 50/60Hz |
| Rated power | 5400W BGA soldering machine |
| Upper hot-air heater | 1200W BGA soldering machine |
| Lower hot-air heater | 1200W BGA soldering machine |
| Lower IR preheating area | 3000W (with excentive IR preheating area suiting for larger PCBa sizes) |
| PCB positioning | V-groove, movable X/Y axis with universa fixtures |
| Chip positioning | Laser pointing at its center repair antminer hash board |
| Touchscreem | 7 inches, real-time temperature curves generating |
Temperature profiles storag | Up to 50,000.00 groups hash board repair service |
Temperature contro | PID, K-type, closed loop |
Temperature accuracy | ±2 ℃ |
PCB size | Max 500×400 mm Min 20×20mm |
| Chip size | 2*2~90*90mm antminer l3 hashboard repair |
| Min chip spacing | 0.15mm repair hashboard |
| Theromocouple | 4 pcs (optional|) asic hash board repair |
| Dimension of BGA soldering machine | L500*W600*H700mm |
| Net weight of BGA rework machine | 41kg |
Ⅱ. Structure of the BGA rework machine used for antminer s9 hash board replacement
Function instruction of the BGA machine s9 hash board repair
upper head: upper hot-air heater inside, which can be moveable upward, downward, backward, fronward, letfward and rightward to make sure the rework process is more convenient for antminer s9 hash board repair
Bearing circle : height adjustable
Upper nozzle: various nozzles with magnetism, which can be rotated 360° for antminer l3+ hash board repair
LED light: 10 W working light with flexible light stem which can be bended for different position to hashboard repair
Cross-flow fan: making PCB and chips cooled after working finshinging or when pressing emergency button downfor BGA machine
Lower nuzzle: various nozzles with magnetism, which can be rotated 360° for mobile ic reballing machine
Thermocouple ports: 4pcs external temperature testing which can help a technician observe more actual temperatures on a motherboard or chip of gamle console, macbook, computer and asic hash board
Power switch: whole machine electricy supplying, which provides safer solution when leakage of electricity or short, it will be cut off immediately for automatic bga rework station
Knob: Upper hot-air adjusting with 10 grades used for different chips of car, computer and mobile phone and so on.
Touchscreen: 7 inches, sensitive interface for temperature, time and other parameters presetting
Switch OFF/ON: press down of cpu reballing machine
Laser point: pointing at the center of chip
Emergency: In case of any emergent, press the button immediately for automatic reballing machine
Ⅲ.Illustration introduction of automatic bga reballing machine
Laser point for mobile phone ic reballing machine
Thermocouple (4 pcs ports) for laptop bga machine
Powerful cross-flow fan of ic reballing machine price
Emergency stop of bga placement machine
Vacuum pen for chip suction of laser bga reballing machine
10W LED working LED of bga reflow machine
motherboard running carefully and evenly of BGA machine for laptop
Ⅳ. Working video of bga soldering machine
rework machine, ic reballing machine
Ⅴ. Shipping and packing of rework station machine
There are several ways you can choose, such as, Fedex, TNT, DHL, SF; sea shipping, air shippig and Land shipping(railway).
And the rail way is avaiable for those country in Asia and Europe. for reballing machine price
Wooden box or carton which are no need fumigation again to any countriy or region, there are wooden bars fixed or foam filled
inside, which make sure boxes can be shipped by any way as above. automatic reballing machine
Ⅵ. After-sales service of ball ic soldering machine
Generally 1~3 years for heaters or IR ceramics,1 year for whole BGA rework machine and free service for the lifespan.
We will continue to provide parts with a little cost after warranty period.
The way for service are online such as, Wechat, WhatsApp, Facebook and Tiktok,etc. Sure, if necessary, we can assign
an engineer to your on-site for guiding. of bga machine for motherboard
Ⅶ. Relevant knowledge about chips and printed circuit board
Emerging technologies have driven dimensions of packages and printed circuit board assembly to be smaller, lighter, and thinner. Electronic industries have gone a long way toward miniaturization of components. Area array packages are an area where miniaturization has occurred at an exciting rate. Ball-Grid-Array (BGA) packages have transformed into smaller Chip-Scale Packages (CSPs) and further into Wafer-Level CSPs (WLCSPs). automatic bga reballing machine can repair them
To further minimize the area on printed circuit boards and increase signal integrity, stacking of CSPs have been developed and are currently being used in products within Huawei. This technology is often referred to as Package-On-Package (POP). chip reballing machine
With the requirements for further miniaturization, bare-dies such as Chip-On-Board (COB) and Flip Chip (FC) merging with traditional surface-mount technology (SMT) assembly have become high demand. By removing the package over-mold materials, the surface area of the components can be further reduced. bga placement machine
Other regions of miniaturization are in passive chip components such as 01005 and 008004. The 01005 is a component with a dimension of 0.016” x 0.008” (0.4 mm x 0.2 mm in metrics), and 008004 is a component of 0.008” x 0.004” (0.25mm x 0.125mm in metrics). some cross-borader companies had started investigation and development of 01005 components around 2008, and the development has allowed then to support our key customers in manufacturing products with 01005 components in volume production. To keep up with the trend of miniaturization, development is currently underway for the next generation 008004 components to meet customer demands in the near future. bga ic reballing machine
In addition to having capabilities of package miniaturization, many companies have also developed process for complex and high density circuit boards with recessed cavity to reduce the overall thickness of the final product. The cavities can reduced effective heights for CSPs, POPs, and COBs.
Overall, important players has been very pro-active in developing advanced techniques to meet the challenges of miniaturization as package dimensions are reduced significantly. Currently, huawei has multiple facilities manufacturing products with 01005 chips, CSPs, POPs, and COBs.
