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Bga Rework Machine For Laptop

The Dinghua DH‑A7 is a high‑performance bga rework station for mobile repair and large‑board SMT rework, engineered for professional chip disassembly, soldering, and placement in high‑demand electronics workshops. As a robust set of soldering stations built for precision and durability, it delivers stable heating, accurate vision alignment, and fully automatic workflows to boost repair yield and efficiency. This versatile mobile phone repair equipment supports ultra‑large PCBs and fine‑pitch BGA chips, making it ideal for mobile repair centers, electronics factories, and industrial maintenance lines.

Description

Product Overview

 

The Dinghua DH‑A7 industrial bga rework station for mobile integrates automatic desoldering, soldering, pickup, and placement in one compact system, designed to handle heavy‑duty rework for mobile device mainboards, large LED boards, and industrial PCBs. Equipped with a high‑definition touchscreen HMI and PLC control, it provides real‑time temperature curve display and instant analysis, allowing operators to adjust and optimize profiles with ease.

Key Features 

 

This advanced unit features a high‑precision K‑type thermocouple closed‑loop control system with automatic temperature compensation, ensuring temperature accuracy within ±3°C. Five external temperature sensor ports support real‑time monitoring and calibration, making the DH‑A7 one of the most reliable soldering stations for consistent, repeatable results in mobile and electronics repair.

 

The DH‑A7 adopts a high‑stability stepping and servo motion control system, paired with a precision digital vision alignment system. Its auto‑extend and retract CCD camera eliminates viewing blind spots, while laser positioning quickly locates the BGA center for fast, accurate alignment. The V‑shaped PCB slot and adjustable universal fixture protect boards from damage and deformation, greatly enhancing the stability of this mobile phone repair equipment.

 

Designed with three independent heating zones, the DH‑A7 bga rework station for mobile supports multi‑segment temperature control for each zone, ensuring uniform heating and ideal soldering results for various BGA components. Each heating zone supports up to 8 temperature segments, and the system stores up to 50,000 temperature profiles for instant recall. The 360° rotatable alloy nozzles are interchangeable for different component sizes, adding to the machine's flexibility.

 

To enhance operational safety and efficiency, the DH‑A7 includes an audible pre‑alert function that beeps 5–10 seconds before cycle completion, allowing operators to prepare in advance. A powerful cross‑flow fan rapidly cools the PCB to prevent warping, while automatic feeding and receiving simplify material handling and speed up production.

 

Certified with CE and equipped with an emergency stop switch and automatic power‑off protection, the DH‑A7 guarantees safe operation in continuous industrial use. Every unit undergoes rigorous temperature calibration and alignment capability analysis to ensure long‑term precision and reliability, solidifying its position as a top‑tier choice among professional soldering stations and mobile phone repair equipment.

 

Products Parameters 

Item Specification  
Total Power 11500W  
Top Heater Power 1200W  
Lower Moving Zone Power 800W  
Bottom Preheat Power 9000W (German heating element)  
Power Supply AC380V±10% 50/60Hz  
Dimensions L1460×W1550×H1850 mm  
Temperature Control K‑type thermocouple closed‑loop  
Temperature Accuracy ±3°C  
Placement Accuracy ±0.01mm  
Max PCB Size 900×790 mm  
Min PCB Size 22×22 mm  
Applicable Chip Size 2×2 – 80×80 mm  
Min Chip Pitch 0.25mm  
External Temperature Ports 5  
Operation Modes Automatic desolder, solder, pick & place  
Profile Storage 50,000 groups  
Net Weight Approx. 120 kg  

 

Products Details

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  • Shenzhen DinghuaTechnology
  • Shenzhen Dinghua Technology
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    Shenzhen Dinghua Technology
  • Shenzhen Dinghua Technology

Certifications

 

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Cooperation

 

 

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