Bga Rework Machine For Laptop
The Dinghua DH‑A7 is a high‑performance bga rework station for mobile repair and large‑board SMT rework, engineered for professional chip disassembly, soldering, and placement in high‑demand electronics workshops. As a robust set of soldering stations built for precision and durability, it delivers stable heating, accurate vision alignment, and fully automatic workflows to boost repair yield and efficiency. This versatile mobile phone repair equipment supports ultra‑large PCBs and fine‑pitch BGA chips, making it ideal for mobile repair centers, electronics factories, and industrial maintenance lines.
Description
Product Overview
The Dinghua DH‑A7 industrial bga rework station for mobile integrates automatic desoldering, soldering, pickup, and placement in one compact system, designed to handle heavy‑duty rework for mobile device mainboards, large LED boards, and industrial PCBs. Equipped with a high‑definition touchscreen HMI and PLC control, it provides real‑time temperature curve display and instant analysis, allowing operators to adjust and optimize profiles with ease.
Key Features
This advanced unit features a high‑precision K‑type thermocouple closed‑loop control system with automatic temperature compensation, ensuring temperature accuracy within ±3°C. Five external temperature sensor ports support real‑time monitoring and calibration, making the DH‑A7 one of the most reliable soldering stations for consistent, repeatable results in mobile and electronics repair.
The DH‑A7 adopts a high‑stability stepping and servo motion control system, paired with a precision digital vision alignment system. Its auto‑extend and retract CCD camera eliminates viewing blind spots, while laser positioning quickly locates the BGA center for fast, accurate alignment. The V‑shaped PCB slot and adjustable universal fixture protect boards from damage and deformation, greatly enhancing the stability of this mobile phone repair equipment.
Designed with three independent heating zones, the DH‑A7 bga rework station for mobile supports multi‑segment temperature control for each zone, ensuring uniform heating and ideal soldering results for various BGA components. Each heating zone supports up to 8 temperature segments, and the system stores up to 50,000 temperature profiles for instant recall. The 360° rotatable alloy nozzles are interchangeable for different component sizes, adding to the machine's flexibility.
To enhance operational safety and efficiency, the DH‑A7 includes an audible pre‑alert function that beeps 5–10 seconds before cycle completion, allowing operators to prepare in advance. A powerful cross‑flow fan rapidly cools the PCB to prevent warping, while automatic feeding and receiving simplify material handling and speed up production.
Certified with CE and equipped with an emergency stop switch and automatic power‑off protection, the DH‑A7 guarantees safe operation in continuous industrial use. Every unit undergoes rigorous temperature calibration and alignment capability analysis to ensure long‑term precision and reliability, solidifying its position as a top‑tier choice among professional soldering stations and mobile phone repair equipment.
Products Parameters
| Item | Specification | |
|---|---|---|
| Total Power | 11500W | |
| Top Heater Power | 1200W | |
| Lower Moving Zone Power | 800W | |
| Bottom Preheat Power | 9000W (German heating element) | |
| Power Supply | AC380V±10% 50/60Hz | |
| Dimensions | L1460×W1550×H1850 mm | |
| Temperature Control | K‑type thermocouple closed‑loop | |
| Temperature Accuracy | ±3°C | |
| Placement Accuracy | ±0.01mm | |
| Max PCB Size | 900×790 mm | |
| Min PCB Size | 22×22 mm | |
| Applicable Chip Size | 2×2 – 80×80 mm | |
| Min Chip Pitch | 0.25mm | |
| External Temperature Ports | 5 | |
| Operation Modes | Automatic desolder, solder, pick & place | |
| Profile Storage | 50,000 groups | |
| Net Weight | Approx. 120 kg |
Products Details


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