Best Automatic BGA Rework Station

 

 

DH-A6 is a high-end intelligent optical BGA rework station designed for advanced PCB repair and high-precision SMT rework applications. Equipped with HD CCD optical alignment, fully automatic chip placement, and an three-zone heating system, it delivers stable, accurate, and efficient rework performance for large motherboards, complex BGA packages, and industrial electronics applications.

 

 

 

DH-A6 is a high-end intelligent optical BGA rework station developed for advanced SMT rework, PCB motherboard maintenance, and industrial chip-level repair applications. As a professional Chip level repair machine, the DH-A6 combines high-precision optical alignment, intelligent automation, and a powerful heating system to deliver stable and repeatable rework performance for complex electronic assemblies.

 

This Rework station for PCB motherboard applications is equipped with a 6-million-pixel HD CCD optical alignment system, automatic optical zoom, and joystick-controlled positioning, allowing operators to accurately observe solder balls and PCB pads from multiple angles without blind spots. With ±0.01 mm placement accuracy and ±1–2°C closed-loop temperature precision, the machine ensures reliable soldering and desoldering results for BGA, QFN, QFP, POP, CSP, and other SMT packages.

 

The DH-A6 Chip level repair machine adopts a three-zone independent heating structure, including 1200W top heater, 1200W lower heater, and an 8000W large-area bottom heater with a 450 × 570 mm heating area. This advanced thermal design minimizes PCB deformation and provides uniform heating for large motherboards, server boards, automotive ECUs, and industrial control PCBs.

 

As a professional BGA desoldering station, the DH-A6 supports fully automatic disassembly, soldering, suction, placement, and chip recovery processes, greatly reducing operator error and improving rework efficiency. The intelligent vacuum suction system automatically releases the chip after precise positioning, while the automatic cooling system protects the PCB from thermal stress after rework completion.

 

This Rework station for PCB motherboard repair also features 8–20 segment programmable temperature profiles, real-time temperature curve analysis, storage for 50,000 profiles, external temperature sensors, laser positioning, and support for nitrogen or inert gas connections. The BGA desoldering station design supports ultra-fine chip spacing down to 0.15 mm, making it suitable for high-density SMT applications and precision semiconductor repair.

 

Widely used in electronics manufacturing, repair centers, aerospace, automotive electronics, communication equipment, and R&D laboratories, the DH-A6 Chip level repair machine provides high automation, excellent rework stability, and professional-grade repair capability for modern PCB motherboard applications.

 

 

 

 

 

Item	Parameter
Power Supply	AC380V±10％ 50/60Hz
Rated Power	11000W
Top heater	1200W
Bottom heater	1200W
IR preheating area	8000W (Germany heating tube, heating area of 450*570mm)
Operation mode	Fully automatically disassemble,suction,mounting and soldering
Chip feeding system	Automatic receiving, feeding, automatic induction (optional)
Temperature profile storage	50000 groups
Temperature accuracy	±1 ℃
Placement Accuracy	+/-0.01mm
Safety guard	pressure sensor +emergency knob,double-guard
PCB size	Max620*700 mm Min 10*10 mm
PCB thickness	0.2-15mm
BGA chip	1x1-80*80mm
Minimum chip spacing	0.15mm
External Temperature Sensor	5 pcs(optional)
Machine type	Desktop table (optional)
Dimensions	L1050*W1130*H1070 mm