Surface Mount IC Replacement Machines

Automatic Surface Mount IC Replacement Machines

Model: DH-A2E

1.Product Features of Automatic Infrared Surface Mount IC Replacement Machines

•High successful rate of chip-level repairing. Desoldering, mounting and soldering process is automatic.

• Convenient alignment.

•Three independent temperature heatings + PID self setting adjusted, temperature  accuracy will be on ±1°C

•Built in vacuum pump, pick up and place BGA chips.

•Automatic cooling functions.

2.Specification of Hot air Automated Surface Mount IC Replacement Machines

Power	5300w
Top heater	Hot air 1200w
Bottom heater	Hot air 1200W. Infrared 2700w
Power supply	AC220V±10% 50/60Hz
Dimension	L530*W670*H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	Ktype thermocouple,closed loop control,independent heating
Temperature accuracy	±2℃
PCB size	Max 450*490 mm, Min 22 *22 mm
Workbench fine-tuning	±15mm forward/backward,±15mm right/left
BGA chip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(optional)
Net weight	70kg

3.Details of Hot Air Automatic Surface Mount IC Replacement Machines

4.Why Choose Our Automatic Surface Mount IC Replacement Machines?

5.Certificate of Optical alignment automatic Surface Mount IC Replacement Machines

6.Packing list of Optics align CCD Camera Surface Mount IC Replacement Machines

7. Shipment of Automatic Surface Mount IC Replacement Machines Split Vision

We ship the machine via DHL/TNT/UPS/FEDEX, which is fast and safe.  If you prefer other terms of shipment, please feel free to tell us.

8.Contact us for instant reply and best price.

Email: john@dh-kc.com

MOB/WhatsApp/Wechat:  +8615768114827

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9.Related knowledge of Automatic Surface Mount IC Replacement Machines

Case: PCBA Application for Epson APS in Advanced Planning Scheduling

I. Project Introduction

1. Current Status of Production Planning

The production process of PCBA (Printed Circuit Board Assembly) at Company A (hereinafter referred to as "Company A") follows a typical multi-variety, small-batch, and high-variation production model. The company produces over 1,000 types of products, with more than 200 mainstream products. It handles hundreds of production orders each month, which decompose into thousands of work orders across various processes.

Company A's planning system follows a three-level model, comprising the planning department, production management department, and workshop scheduling. Planning, scheduling, order release, reporting, and adjustment largely rely on manual methods, including meetings and paper-based processes. Scheduling meetings are held twice a week, with two plans set for each day. The scheduling workload is extremely heavy and complex, requiring highly skilled personnel with extensive experience.

Once the production management department issues production orders to each workshop, the individual workshop dispatch planners create detailed schedules based on the original plan's execution status, available resources, and associated workshop schedules. As the plans for each workshop are interconnected, the workshop planners communicate as necessary to adjust and coordinate the schedules.

2. Business Challenges

The standard production route in a PCBA enterprise is as follows: "SMT (Surface Mount Technology) - wave soldering - testing - aging." Based on demand research, the APS (Advanced Planning Scheduling) process model is determined to be: "SMT - wave soldering - testing - aging." The key scheduling challenges are as follows:

(1) SMT Process
SMT, or Surface Mount Technology, is a circuit-mounting technique in which leadless or short-lead surface-mount components are attached to the surface of a printed circuit board (PCB) or other substrate and soldered using reflow or dip soldering techniques.

The SMT workshop has multiple production lines, each capable of producing different types of equipment. The following factors must be considered when planning production:

• Line Load Balancing: Efforts should be made to balance production loads between lines, ensuring that the final completion times for each line are as consistent as possible.
• Continuous Production: The goal is to ensure that the production lines run continuously, with minimal idle time, to maximize equipment utilization.
• Sub-resource Restrictions (Stencil Limitations): Each product requires specific stencil resources. Each stencil can only be used by one production line at a time. Orders using the same stencil cannot be processed simultaneously.
• Reducing Mold Change Times: If multiple orders require the same stencil, efforts should be made to arrange them for continuous production to minimize the time spent switching stencils.
• Order Lead Time: Scheduling should be arranged based on the order's delivery requirements to ensure timely delivery.
• SMT Line Variability: Some production lines are faster than others. Orders that can be processed on faster lines should be prioritized for those lines.
• Automatic Scheduling: Once the scheduling rules are set, planning can be adjusted with a single click using intelligent, automatic scheduling to optimize responses.
• Handling Production Abnormalities: Equipment downtime, maintenance, material shortages, or emergency order insertions can disrupt production. In such cases, the production order should remain unchanged if previously locked, and a rapid response adjustment plan should be implemented.
• Rolling Schedule: The plan should be adjusted according to production performance, rolling the schedule to accommodate changes as necessary.
• Material Planning: Accurate start times for each order can be determined, allowing the logistics department to prepare and distribute materials accordingly. This helps reduce downtime and minimize in-process or line-side inventory.

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