Small Infrared BGA Rework Station
DH-6500 is a fully infrared BGA rework station with 2 IR heating zones, the upper IR heating zone is 80*80mm, lower IR heating zone used for PCB size, Max 360*300mm, much bigger than other similar machines/models, which is suitable for Xbox, washing machine, refrigerator and TV etc. repairing.
Description
The Small Infrared BGA Rework Station is a compact and efficient tool designed for repairing and reworking BGA, SMD, and other electronic components. It uses infrared heating technology to ensure uniform heat distribution, minimizing the risk of damage to nearby components. Ideal for small-scale repair shops or laboratories, it offers precise temperature control and easy operation. This station is suitable for desoldering, soldering, and reballing tasks on PCBs. Its small footprint makes it perfect for use in space-limited environments.
DH-6500 Infrared BGA Rework Station
The DH-6500 has been developed and used in the market for more than 10 years. It mainly consists of two IR heating zones and two temperature controllers. The system is simple and easy to operate, and it is widely used in gaming consoles, TVs, and other domestic appliance industries.
The upper infrared heating area features a ceramic heater sized up to 80×80 mm with a wavelength range of 2–8 μm, which is easily absorbed by most black and light-colored materials. The unit supports 110–250V at 50/60Hz.
The lower IR preheating zone is equipped with an anti-high-temperature glass shield, which provides more even heating to ensure better protection of large components during heating.
The system includes V-groove, alligator clips, and movable universal fixtures, which can accommodate motherboards of various shapes, allowing them to be securely fixed at the optimal position for soldering or desoldering.
The maximum PCB size supported is 360×300 mm, and component sizes range from 2×2 mm up to 78×78 mm.
Digital IR Machine Features
- Two temperature controllers
- Ten temperature profiles can be saved
- One external thermocouple for real-time temperature monitoring
- Color-coded buttons for easy operation
Technical Specifications of the Infrared BGA Rework Station
| Parameter | Specification |
| Power Supply | 110–250V, 50/60Hz |
| Power | 2500W |
| Heating Zones | 2 IR zones |
| PCB Size | Up to 300×360 mm |
| Component Size | 2×2 to 78×78 mm |
| Net Weight | 16 kg |
FAQ
Q: Can I become your distributor in my country?
A: Yes, you can.
Q: Are there any well-known companies using your products?
A: Yes, companies such as Google, Huawei, and Mitsubishi use our products.
Q: Do you accept new product design proposals?
A: Yes, if you have any new design or solution ideas, please contact us at John@dinghua-bga.com.
Q: Can I buy directly from your country?
A: Yes, we can ship the product directly to your door via express delivery.
Some Tips About the IR BGA Rework Station
What is a profile?
A profile is the temperature curve that the rework station follows to desolder and solder BGA components.
The profile consists of four distinct phases, which are explained below:
- Preheater: This phase brings the board to a uniform temperature between 150°C and 180°C. This temperature does not affect the solder joints but reduces the temperature difference (delta T) between the top and bottom, preventing damage to the board or BGA.
- Soak: In this phase, the board is heated to activate the flux. This is important because the flux must be activated within a specific time frame to perform its function properly.
- Reflow: During this phase, the solder balls melt and bond to the pads. It is critical that this phase lasts the correct amount of time since components cannot withstand prolonged exposure to high temperatures. Typically, the BGA is held at around 260°C for 20–30 seconds. Temperatures above 260°C may damage common BGA packages.
- Cool Down: This phase involves controlled cooling of the BGA, usually at a rate not exceeding 2–3°C per second, to avoid thermal stress.
