Touch Screen Macbook BGA Rework Station

                                                                     Touch screen Samsung bga rework station

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Original factory price! DH-A1 BGA Rework Machine with IR heater for ipad repairing is now in stock.It is designed by 

user-friendly operation system,aiming to help operator to understand how to use within few minutes.

1. Specification

2.Description of the DH-A1 BGA rework station

Features:

1. Infrared welding technology.

2. Infrared heating, can avoid the IC damage due to the fast or uninterrupted heating up.

3. Easy operate; User can operate skillfully after one-day training.

4. No need welding tools, it can weld any chips under 50mm.

5. With 800W hot melt system, preheating range 240*180mm.

6. It doesn't impact the smart parts without hot air, and suits to weld BGA, SMD, CSP, LGA, QFP, PLCC and BGA reballing.

7. It suits for a variety of computer, notebook, play station's BGA components, especially in a Northbridge/ Southbridge chipset of .

3.Why you should choose DH-A1 bga rework station?

Please have a look at the below picture to compare the real affect after using our brand bga rework station with others before you make decision.

4. Related Knowledge：

Soldering Reflow Profile

The soldering reflow profile has to be created to a component according to component density, size, weight, colour and 

substrate type as these are main factors which determine heat convection rate through the layers of silicon. As the component 

been exposed to environment the original manufacturing profile cannot be used as it could be too aggressive and damage the

 board to the state of BER. Component data sheets and solder paste type used during manufacturing specifications are acquired

 to determine the peak melting point, which profile will be based upon. Typical de-soldering profile involves preheating, soak, reflow 

and cooling stages. Typical preheat stage is a ramp up of heat at around 3C/s up to 120 – 150C, depending on the solder alloy used.

 This stage ensures no heat shock damage occurs to the all substrates and expansion rates across the board are kept at similar ratio. 

During soak stage the temperature is ramped up to reach 170 – 210C in targeted area. Maintaining steep profile curve at this stage 

will allow to keep the profile short maintaining less than 5 minute total heat cycle. Liquidus stage 190C – 230C is crucial and we keep 

it as short as possible to prevent solder mask damage on component during automated vacuum powered lift. The last cool-down stage 

temperature curve is typically 5-6C/s to bring component back to environment temperature efficiently and without shock.

BGA IC Replacement

By far the most successful process available to recover printed circuit board with BGA failures. However, this process is the most expensive

 and cannot be applied to obsolete or EOL components. During this process old component has be removed, PCB BGA site cleaned and new 

component soldered in place. High success rate depends on quality of parts provided by supplier and information available, such as alloy type.

5.Detailed Images of DH-A1 BGA REWORK STATION

6.Packing & delivery details of DH-A1 BGA REWORK STATION

Delivery detials of DH-A1 BGA REWORK STATION

7. Service

a. Your inquiry related to our products or prices will be replied within 24hours.

b.Be Well-trained and experienced to answer all your enquires in fluent English

c. OEM&ODM, any your request we can help you to design and put into product.

d. Distributors are offered for your unique design and some our current models

e. Protection of your sales area, ideas of design and all your private information.

We always answer your questions: 24 hours a day, 7 days a week.