PS3 PS4 TV Laptop Mobile Phone Repairing Machine

PS3 PS4 TV Laptop mobile phone repairing machine DH-A2E

 

Removing of BGA Ball and tin

 

Specifications:

1	Total power	5200w
2	3 independent heaters	Top hot air 1200w, lower hot air 1200w, bottom infrared preheating 2700w
3	Voltage	AC220V±10% 50/60Hz
4	Electric parts	7'' touch screen + high precision intelligent temp control module + stepper motor driver + PLC + LCD display + high resolution optical CCD system + laser positioning
5	Temperature control	K-Sensor closed-loop + PID automatic temp compensation + temp module, temp accuracy within ±2℃.
6	PCB positioning	V-groove + universal fixture + movable PCB shelf
7	Applicable PCB size	Max 370x410mm Min 22x22mm
8	Applicable BGA size	2x2mm~80x80mm
9	Size	600x700x850mm (L*W*H)
10	Net weight	70 Kg

Applications:

 

Characteristic:

 

PS3, PS4, TV, Laptop, Mobile Phone Repairing Machine - DH-A2E

• Widely used for chip-level repairs in laptops, PS3, PS4, Xbox 360, mobile phones, computers, TVs, control boards, etc.
• Reworks BGA, CCGA, QFN, CSP, LGA, SMD, LED, and other components.
• Automatic desoldering, mounting, and soldering; automatically picks up the chip once desoldering is complete.
• HD CCD optical alignment system for precise mounting of BGA and components.
• BGA mounting accuracy within 0.01mm; repair success rate of 99.9%.
• Laser positioning for fast BGA chip and motherboard alignment.
• Superior safety features with emergency protection.

Working video of automatic BGA rework station: 

 

 
Accessories:
1. Top nozzle:3 pcs (31*31mm,38*38mm,41*41mm).  Bottom nozzle:2pcs(34*34mm,55*55mm)

2. Beam:2 pcs
3. Plum knob: 6 pcs
4. Universal fixture:6 pcs
5. Support screw:5 pcs
6. Brush pen:1 pcs
7. Vacuum cup:3 pcs
8. Vacuum needle:1 pc
9. Tweezer:1 pc
10. Temp sensor wire:1 pc
11. Professional Instruction Book:1 pc
12.  CD demo: 1 pc