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BGA

BGA Rework Station For Mobile Phone

US $5.00-$2999.00 / Piece
1 Piece Min. Order
Dimensions: 500*460*640mm
Weight: 35KG
Rated Capacity: 2500W
Current: 20A
Voltage: AC 110~240 V±10% 50/60Hz
Rated Duty Cycle: 100%

Description

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BGA Rework Station For Mobile Phone Features:

1.      Auto de-soldering & re-soldering, easy operation, portable to carry.

2.      The repair success rate reaches up to 99%, under correct operation.

3.      High temperature control system, with precise k-type thermocouple closed-loop control, PID auto temperature compensation system, external temp. sensor, which make the deviation ±2℃.

4.      Two operation modes in system: automatic and manual, which is easy to switch between the two for best work effect.

5.      Auto mode include: Auto feeding system, auto BGA / IC pick and place, laser position, auto d-soldering and re-soldering.

6.      Manual mode is mainly used to touch HD screen for temperature curve/profile set-up or adjustment, make top & bottom heaters height adjustment, and the camera movement, and the external temperature test, if necessary.

7.      HD touch screen conversational interface, with PLC control of multi-functional integrated programs, which makes the operation quite conveniently and easily.

8.      Able to set up 8 segments of temperature, with changeable top heating and lower heating (up to 16 segments). And un-limited number of temperature profiles stored in program.

9.      Free to adjust or re-set up the curve during the work, once it necessary to make the change.

10.  High quality of radiating fan with big volume of wind-force, run automatically right after the heating work( down to < 45℃ ) to support high efficient cooling, and prevent the heater age.

11.  Panasonic branded optical alignment system with auto-folded CCD camera, in MAX 220x, which makes the vision clear and reliable.

12.  Human structure design, auto folding optical lens, freely optional set-up of temperature curve.

13.  Precise designed universal fixtures, make the PCB can be adjusted in X, Y, Z direction with “5 points support” + V-groove and PCB bracket, which make it free to position the PCB rapidly.

14.  Laser point positioning makes the position of chip/IC easy, accurate and rapid.

15.  Also, the flexible movable fixtures help to prevent other fringe part of PCB being deformed, and widen the use range of PCB sizes.

16.  High power LED light for observing machine work more visually.

17.  Auto safety and reminder system: auto voice warning at 5 seconds before heating finish.

18.  Double protection: Overheating guard + emergency stop function.

CE certification approval.           

Packing Lisk                         

Total Power

2500W

Top heater

1200W

Bottom  heater

1200W

Voltage

AC110/220V±10%  50/60Hz

Operation  mode

Two modes:  manual and automatic.

HD touch  screen, intelligent man-machine, digital system setting.

OpticalCCD camera  lens

90°open/folding

Optical CCD

6 million  pixel

Monitor  screen

1080P

Camera  magnification

1x - 220x

Workbench  fine-tuning

±15mm  forward/backward, ±15mm right/left,

Upper  micrometer for angle adjusting

60°

Placement  accuracy

±0.01mm

PCB position

Intelligent  positioning, PCB can be adjusted in X, Y direction with “5 points support” +  V-groove PCB bracket + universal fixtures.

Lighting

Taiwan led  working light, any angle adjustable

Temperature  control

K sensor,  close loop, PLC control

Temp  accuracy

±2℃

PCB size

All kinds of  mobile phone motherboard

BGA chip  size

1x1 - 80x80  mm

Minimum chip  spacing

0.15mm

External  temper sensor

1pc , or  more at your option

Temperature  profile storage

50,000 groups(un-limited  number of groups)

Dimensions

L500×W460×H640  mm

Weight

35KG

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