BGA Rework Station For Mobile Phone
US $5.00-$2999.00 / Piece
1 Piece Min. Order
Dimensions: 500*460*640mm
Weight: 35KG
Rated Capacity: 2500W
Current: 20A
Voltage: AC 110~240 V±10% 50/60Hz
Rated Duty Cycle: 100%
Description






BGA Rework Station For Mobile Phone Features:
1. Auto de-soldering & re-soldering, easy operation, portable to carry.
2. The repair success rate reaches up to 99%, under correct operation.
3. High temperature control system, with precise k-type thermocouple closed-loop control, PID auto temperature compensation system, external temp. sensor, which make the deviation ±2℃.
4. Two operation modes in system: automatic and manual, which is easy to switch between the two for best work effect.
5. Auto mode include: Auto feeding system, auto BGA / IC pick and place, laser position, auto d-soldering and re-soldering.
6. Manual mode is mainly used to touch HD screen for temperature curve/profile set-up or adjustment, make top & bottom heaters height adjustment, and the camera movement, and the external temperature test, if necessary.
7. HD touch screen conversational interface, with PLC control of multi-functional integrated programs, which makes the operation quite conveniently and easily.
8. Able to set up 8 segments of temperature, with changeable top heating and lower heating (up to 16 segments). And un-limited number of temperature profiles stored in program.
9. Free to adjust or re-set up the curve during the work, once it necessary to make the change.
10. High quality of radiating fan with big volume of wind-force, run automatically right after the heating work( down to < 45℃ ) to support high efficient cooling, and prevent the heater age.
11. Panasonic branded optical alignment system with auto-folded CCD camera, in MAX 220x, which makes the vision clear and reliable.
12. Human structure design, auto folding optical lens, freely optional set-up of temperature curve.
13. Precise designed universal fixtures, make the PCB can be adjusted in X, Y, Z direction with “5 points support” + V-groove and PCB bracket, which make it free to position the PCB rapidly.
14. Laser point positioning makes the position of chip/IC easy, accurate and rapid.
15. Also, the flexible movable fixtures help to prevent other fringe part of PCB being deformed, and widen the use range of PCB sizes.
16. High power LED light for observing machine work more visually.
17. Auto safety and reminder system: auto voice warning at 5 seconds before heating finish.
18. Double protection: Overheating guard + emergency stop function.
CE certification approval.
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Total Power |
2500W |
|
Top heater |
1200W |
|
Bottom heater |
1200W |
|
Voltage |
AC110/220V±10% 50/60Hz |
|
Operation mode |
Two modes: manual and automatic. HD touch screen, intelligent man-machine, digital system setting. |
|
OpticalCCD camera lens |
90°open/folding |
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Optical CCD |
6 million pixel |
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Monitor screen |
1080P |
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Camera magnification |
1x - 220x |
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Workbench fine-tuning |
±15mm forward/backward, ±15mm right/left, |
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Upper micrometer for angle adjusting |
60° |
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Placement accuracy |
±0.01mm |
|
PCB position |
Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groove PCB bracket + universal fixtures. |
|
Lighting |
Taiwan led working light, any angle adjustable |
|
Temperature control |
K sensor, close loop, PLC control |
|
Temp accuracy |
±2℃ |
|
PCB size |
All kinds of mobile phone motherboard |
|
BGA chip size |
1x1 - 80x80 mm |
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Minimum chip spacing |
0.15mm |
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External temper sensor |
1pc , or more at your option |
|
Temperature profile storage |
50,000 groups(un-limited number of groups) |
|
Dimensions |
L500×W460×H640 mm |
|
Weight |
35KG |













