LED Rework Station Automatic

     

1.Application Of LED Rework Station Automatic

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP,PBGA,CPGA,LED chip. 

2.Product Features of laser position LED Rework Station Automatic

3.Specification of laser positioning 

power	5300W
Top heater	Hot air 1200W
Bottom heater	Hot air 1200W.Infrared 2700W
Power supply	AC220V±10% 50/60Hz
Dimension	L530*W670*H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	K type thermocouple, closed loop control, independent heating
Temperature accuracy	±2℃
PCB size	Max 450*490 mm,Min 22*22 mm
Workbench fine-tuning	±15mm forward/backward,±15mm right/left
BGAchip	80*80-1*1mm
Minimum chip spacing	0.15mm
Temp Sensor	1(optional)
Net weight	70kg

4.Details of Hot Air LED Rework Station Automatic

5.Why Choose Our Infrared LED Rework Station Automatic? 

6.Certificate of Optical Alignment

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, 

Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

7.Contact us for LED Rework Station Automatic

Email: alicehuang@dinghua-bga.com

MOB/WhatsApp/Wechat: +13723478812

Click the link to add my WhatsApp:

https://api.whatsapp.com/send?phone=8613723478812

8. Related knowledge of LED Rework Station Automatic

PCB Circuit Board Manufacturing Packaging Process

"PCB circuit board packaging" is a crucial process, yet many PCB companies do not pay sufficient attention to this final step, leading to inadequate protection for the PCBs. This can result in issues such as surface damage or friction.

PCB board packaging is often taken less seriously in factories, primarily because it does not generate added value. Additionally, Taiwan's manufacturing industry has historically overlooked the immeasurable benefits of product packaging. Therefore, if PCB companies make small improvements in "packaging," the results could be significant. For instance, Flexible PCBs are typically small and produced in large quantities. Adopting effective packaging methods, such as custom-designed containers, can enhance convenience and protection.

Discussion of Early Packaging

Early packaging methods often relied on outdated shipping techniques, highlighting their shortcomings. Some small factories still use these outdated methods. With domestic PCB production capacity rapidly expanding and a focus on exports, competition has intensified. This includes not only domestic factory competition but also rivalry with leading U.S. and Japanese PCB manufacturers. In addition to technical capabilities and product quality, packaging quality must also meet customer satisfaction. Many small electronics manufacturers now require PCB manufacturers to adhere to specific packaging standards, including:

1. Must be vacuum packed.
2. The number of plates per stack is limited based on size.
3. Specifications for the tightness of each PE film coating and margin width.
4. Specifications for PE film and air bubble sheets.
5. Carton size specifications.
6. Requirements for special release buffers before placing the boards inside cartons.
7. Resistance specifications after sealing.
8. Weight limits per box.

Currently, vacuum skin packaging in China is similar across the board, with the main differences being effective working area and automation levels.

Vacuum Skin Packaging (VSP) Operating Procedure

1. Preparation: Position the PE film, manually operate the mechanical components, and set the heating temperature and vacuum time.
2. Stacking Boards: When the number of stacked plates is fixed, their height must also be considered to maximize output and minimize material use. The following principles should be followed:

• The spacing between each laminated plate depends on the PE film thickness (standard is 0.2mm). Using heat and softening principles during vacuuming, the board should be pasted with bubble cloth. The spacing should be at least twice the total plate thickness. Excessive spacing wastes material, while insufficient spacing can cause difficulty in cutting and adhesion.
• The distance between the outermost plate and the edge should also be at least twice the plate thickness.
• For smaller panel sizes, the above method may waste materials and manpower. For larger quantities, consider using soft board packaging methods and then applying PE film shrink packaging. Alternatively, with customer approval, gaps between stacks can be eliminated, using cardboard separators and appropriate stack counts.

Start:

• A. Press start to heat the PE film, lower the pressure frame to cover the table.
• B. Suck the air from the bottom vacuum to adhere the film to the circuit board and bubble cloth.
• C. After cooling, raise the frame.
• D. Cut the PE film, separate the chassis.

Packing: Packaging methods specified by the customer must be followed. If none are provided, factory packing specifications should ensure that the protective board is not damaged by external forces. Special attention is needed for export packaging.

Other Notes:

• A. Include necessary information on the box, such as the item number (P/N), version, period, quantity, and important notes, including "Made in Taiwan" if exported.
• B. Attach relevant quality certificates, such as slicing and weldability reports, test records, and any specific reports required by customers.

PCB board packaging is not complicated; by paying attention to every detail in the packing process, we can effectively avoid unnecessary issues later.