BGA Rework Reballing Station

       BGA rework reballing station

 

DH-A2 is the most hot-sale model in overseas market and Chinese market, so far it applied by Foxconn,

Huawei and many many factories, also it is a popular one for a repair shop, such as, Apple service center,

Xiaomi service center and other personal repair shops,etc. as it is high efficiency and cost-effective.

 

1. Application of BGA rework reballing station

 

To solder, reball, desolder a different kind of chips: 

 

BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, PBGA,CPGA,LED chips, and so on.

2. Product Features of BGA rework reballing station

* Stable and long lifespan(designed for 15 years using)

* Can repair different motherboards with high successful rate

* Strictly control heating and cooling temperature

* Optical alignment system: mounting accurately within 0.01mm

* Easy to operation. Anyone can learn to use it in 30 minutes. No special skill is needed.

3. Specification of BGA rework reballing station

 

Power supply	110~240V 50/60Hz
Power rate	5400W
Auto level	solder, desolder, pick up and replace, etc.
Optical CCD	automatic with a chip feeder
Running control	PLC (Mitsubishi)
chip spacing	0.15mm

Touchscreen	curves appearing, time and temperature setting
PCBA size available	22*22~400*420mm
chip size	1*1~80*80mm
Weight	about 74kg
Packing dims	82*77*97cm

 

4. Details of BGA rework reballing station

 

1. Top hot-air and a vacuum sucker installed together, which is conveniently picking up a chip/component for aligning.

 

2. Optical CCD with a split vision for those dots on a chip vs motherboard imaged on a monitor screen.

3. The display screen for a chip(BGA,IC,POP and SMT,etc.) vs its matched motherboard's dots aligned before soldering.

 

 

4. 3 heating zones, upper hot-air, lower hot-air and IR preheating zones, which can be used for small to

iPhone motherboard, also, up to computer ann TV mainboards, etc. 

5. IR preheating zone covered by steel-mesh, which makes heating elements evenly and safer.

 

 

6. Operation interface for time and temperature setting, temperature profiles can be stored as

many as 50,000 groups.

 

 

 

 

5. Why Choose Our BGA rework reballing station? 

 

6. Certificate of BGA rework reballing station

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system,

Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

7. Packing & Shipment of BGA rework reballing station

 

8. Shipment for the BGA rework reballing station

DHL, TNT, FEDEX, SF, Sea transportation and other special lines,etc.. If you want another shipping term,

please tell us. We will support you.

 

9. Terms of Payment

Bank transfer, Western Union, Credit Card.

Please tell us if you need other support. 

 

10. Operation guide for the BGA rework station DH-A2

 

 

11. The relevant knowledge for BGA rework reballing station

 

Steps to use the BGA rework station

1. Start the procedure:

1.1 Check that the connection of the external power supply is normal 220V.

1.2 Turn on the power switch of each unit of the machine

3. Disassembly procedure:

3.1 The PCBA BGA card to be removed is fixed in the support frame of the PCBA card.

3.2 Move the PCBA to the height limit bar, adjust the height of the support frame so that the top surface of the PCBA is in contact

with the bottom of the height limit bar.

3.3 Turn the positioning head clockwise to the 90 ° position directly in front and move the PCBA to center the position of the com-

ponent to be removed and the red center of the alignment head.

3.4 Use the handle to select the heating program to remove the component

3.5 Position the left heating head directly on the component to be removed and the machine will automatically heat the component.

3.6 If heated to 190 degrees, the machine emits an intermittent "beep ... beep" sound. At this point, the temperature is calibrated o-

nce (control button); When the machine heats up to emit a "beep ... continuous beep", the vacuum switch is on, press to lift the head,

vacuum the component, rotate the heating head on the left platform of the storage component, press To raise your head, the BGA will

drop automatically and the BGA will be removed.

3.7 Follow the steps above to remove the components.

4. The process of loading the components:

4.1 The PCBA is loaded according to the steps described in points 3.1-3.2 above.

4.2 Position the BGA to be soldered in the center of the platform where the BGA is connected, move the PCB bracket (left-right dire-

ction) so that the BGA is directly under the vacuum nozzle. Press the button, the lower part of the set head towards the lower end,

manually turn the switch of the set head to make sure that the nozzle reaches the upper surface of the BGA and make the device a-

utomatically turn on the vacuum switch (vacuum cleaner), then manually turn it to the original position, press the handle button and

the positioning head automatically rises to the highest position.

4.3 Remove the recording tool so that it is directly under the nozzle component, move the PCB board holder so that the position of

the component to be soldered is directly under the recording tool and adjust the height of the component appropriately to create

the clear image

4.4 You can see that the monitor has red BGA pins and blue PAD pad points. Adjust the two sets of stitches to their corresponding

positions one at a time. After centering, push the locator to the original position and click the handle button to leave the BGA co-

mponent mounts in the position of the corresponding component of the PCB board until the vacuum switch light (vacuum cleaner)

goes off, lift slightly the mounting head and click the button to return to the mounting head.

4.5 Repeat steps 3.3-3.5 above

4.6 If heated to 190 degrees, the machine emits a "beep ... beep". Watch the soldering process at the bottom of the component

through the monitor), indicating that soldering has been completed normally, remove the heating head and move the PCBA to the

fan to cool down.

 

5. Temperature setting:

Stripping temperature setting:

See the configuration supplied with the machine

Welding temperature adjustment:

See the configuration supplied with the machine

 

6. Issues requiring attention:

1. Pay attention to the contact of each device unit during operation to avoid damage to related parts.

2. The operator pays attention to his own safety to avoid electric shock and burns.

3. Maintain and maintain equipment, keep all aspects clean and tidy.

4. After using the equipment, it must be installed on time, well organized and compliant with 5S requirements.

5. If a problem occurs, resolve it immediately by the technician or process engineer.