BGA Rework System Automatic

BGA Rework System Automatic

1.Shenzhen Dinghua DH-A2 BGA Rework System Automatic.
2.Semi-automated.
3.Split vision optic align CCD camera.
4.Can rework different SMD components such as BGA, QFN, LED etc.

Description

                                        

BGA rework systems have evolved from early manual processes to the present. Today, many of these systems offer automated features

that can greatly increase efficiency and accuracy during the rework process. With automated features such as component detection, placement and alignment, technicia-ns can save time and reduce the risk of errors that can occur during manual processes. These

systems also typically include real-time monitoring and feedback, allowing for quick adjustments and minimi-zing the possibility of defects. Ultimately, investing in a BGA rework system with automated capabilit-ies can lead to a leaner, more efficient repair process.

 SMD Rework Soldering Station

 SMD Rework Soldering Station

1.Application 

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,

TSOP, PBGA,CPGA,LED chip.

2.Product Features of BGA Rework System Automatic

 SMD Rework Soldering Stationt

3.Specification of laser positioning 

power 5300W
Top heater Hot air 1200W
Bottom heater Hot air 1200W.Infrared 2700W
Power supply AC220V±10% 50/60Hz
Dimension L530*W670*H790 mm
Positioning V-groove PCB support, and with external universal fixture
Temperature control K type thermocouple, closed loop control, independent heating
Temperature accuracy ±2℃
PCB size Max 450*490 mm,Min 22*22 mm
Workbench fine-tuning ±15mm forward/backward,±15mm right/left
BGAchip 80*80-1*1mm
Minimum chip spacing 0.15mm
Temp Sensor 1(optional)
Net weight 70kg

4.Details of Hot Air BGA Rework System Automatic

ic desoldering machine

chip desoldering machine

pcb desoldering machine

5.Why Choose Our Infrared BGA Rework System Automatic?

motherboard desoldering machinemobile phone desoldering machine

6.Certificate of Optical Alignment 

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, 

Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

pace bga rework station

7.Packing & Shipment of CCD Camera 

Packing Lisk-brochure

8.Shipment for BGA Rework System Automatic Split Vision

DHL/TNT/FEDEX. If you want other shipping term, please tell us. We will support you.

9. Related knowledge of BGA Rework System Automatic

In 1906, American DeForrest invented the vacuum triode to amplify the sound current of the telephone. Since then, there has been a strong expectation that a solid device could be developed as a lightweight, low-cost, and long-lasting amplifier and electronic switch. In 1947, the birth of point-contact germanium transistors opened a new chapter in the history of electronic devices. However, this type of transistor has an Achilles' heel: its contact point is unstable in construction. Alongside the development of point-contact transistors, junction transistor theory was proposed, but it wasn't until people could prepare ultra-high-purity single crystals and control the conductivity type of the crystal that junction transistor materials truly emerged. In 1950, the earliest bismuth alloy type transistor with practical value was born. In 1954, a junction silicon transistor was developed. Since then, the idea of a field-effect transistor has been proposed. With advancements in material technologies such as defect-free crystallization, defect control, pressure-resistant oxide film preparation, corrosion resistance, and lithography, various electronic devices with excellent performance have emerged. Electronic components have gradually transitioned from the era of vacuum tubes to the era of transistors and large-scale, ultra-large-scale integrated circuits. This transformation anchors the semiconductor industry as a representative of high-tech industry.

 

Due to the needs of social development, electronic devices have become increasingly complex, requiring reliability, speed, low power consumption, lightweight construction, miniaturization, and low cost. Since the concept of integrated circuits was proposed in the 1950s, the first generation of integrated circuits was successfully developed in the 1960s, thanks to advances in integrated technologies such as materials technology, device technology, and circuit design. The emergence of integrated circuits has epoch-making significance: their birth and development have promoted the advancement of copper core technology and computers, leading to historic changes in various fields of scientific research and the structure of industrial society. Integrated circuits, developed with superior science and technology, have provided researchers with more advanced tools and numerous cutting-edge technologies. These technologies have further led to the emergence of higher-performance, less expensive integrated circuits. For electronic devices, the smaller the volume, the higher the integration; the shorter the response time, the faster the calculation process; the higher the transmission frequency, the greater the amount of information transmitted. The semiconductor industry and semiconductor technology are regarded as the foundation of modern industry and have also developed as a relatively independent high-tech sector.

 

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